Fraunhofer Institute for Reliability and Microintegration IZMWafer Level System Integration
- New techniques for wafer-level packaging and chip assembly for power electronicsNew techniques for wafer-level packaging and chip assembly for power electronics
- Polymers for High Density wiringPolymers for High Density wiring
- Wafer Bonding, Thinning, Thin Wafer HandlingWafer Bonding, Thinning, Thin Wafer Handling
- Permanent Wafer to Wafer BondingPermanent Wafer to Wafer Bonding
- Polymers for high-density WiringPolymers for high-density Wiring
- High-Density RedistributionHigh-Density Redistribution
- High Density AssemblyHigh Density Assembly
- Glass Substrates and LayersGlass Substrates and Layers
- Sensor DevelopmentSensor Development
- TSV IntegrationTSV Integration
- TGV IntegrationTGV Integration
- Hermetic MEMS & Sensor PackagingHermetic MEMS & Sensor Packaging
- Single Chip BumpingSingle Chip Bumping
- Goldstud Bumping Goldstud Bumping
- Thermocompression BondingThermocompression Bonding
- Interconnect Metallurgy and ProcessesInterconnect Metallurgy and Processes