Fraunhofer Institute for Reliability and Microintegration IZMProcess and Product Development
Wafer Level System Integration
- New techniques for wafer-level packaging and chip assembly for power electronicsNew techniques for wafer-level packaging and chip assembly for power electronics
- Polymers for High Density wiringPolymers for High Density wiring
- Wafer Bonding, Thinning, Thin Wafer HandlingWafer Bonding, Thinning, Thin Wafer Handling
- Permanent Wafer to Wafer BondingPermanent Wafer to Wafer Bonding
- Polymers for high-density WiringPolymers for high-density Wiring
- High-Density RedistributionHigh-Density Redistribution
- High Density AssemblyHigh Density Assembly
- Glass Substrates and LayersGlass Substrates and Layers
- Sensor DevelopmentSensor Development
- TSV IntegrationTSV Integration
- TGV IntegrationTGV Integration
- Hermetic MEMS & Sensor PackagingHermetic MEMS & Sensor Packaging
- Single Chip BumpingSingle Chip Bumping
- Goldstud Bumping Goldstud Bumping
- Thermocompression BondingThermocompression Bonding
- Interconnect Metallurgy and ProcessesInterconnect Metallurgy and Processes
Photonics
- LED Failure AnalysisLED Failure Analysis
- LED ReliabilityLED Reliability
- GlassPack - Optical Packaging for DatacomGlassPack - Optical Packaging for Datacom
- High-Precision Assembly of Micro-Optical ComponentsHigh-Precision Assembly of Micro-Optical Components
- PrOpSys – Production Technology for Optical SystemsPrOpSys – Production Technology for Optical Systems
- OptoelectronicsOptoelectronics
System Integration on Flexible and Rigid Substrates
- Flip Chip Adhesive Bond Technologies
- Flip Chip Soldering on Flexible Substrates
- Ultrafine Pitch Soldering on Flexible Substrates
- Ultrathin Solder Interconnections
- Ultrathin Flip Chip Assemblies
- Diebond, Pick and Place
- Die and Wire Bonding for High Frequency ApplicationsDie and Wire Bonding for High Frequency Applications
- Conformable ElectronicsConformable Electronics
- Embedding