Fraunhofer Institute for Reliability and Microintegration IZMManufacturing & Prototyping
Wafer Level System Integration
- Fine-pitch Bumping for Pixel DetectorsFine-pitch Bumping for Pixel Detectors
- High-Density RedistributionHigh-Density Redistribution
- Wafer Bonding, Thinning, Thin Wafer HandlingWafer Bonding, Thinning, Thin Wafer Handling
- Permanent Wafer to Wafer BondingPermanent Wafer to Wafer Bonding
- Polymers for high-density WiringPolymers for high-density Wiring
- High Density AssemblyHigh Density Assembly
- Glass Substrates and LayersGlass Substrates and Layers
- Sensor DevelopmentSensor Development
- TSV IntegrationTSV Integration
- TGV IntegrationTGV Integration
- Fabrication of nanoporous gold DepositsFabrication of nanoporous gold Deposits
- Single Chip BumpingSingle Chip Bumping
- Gold Stud BumpingGold Stud Bumping
- Thermocompression BondingThermocompression Bonding
System Integration & Interconnection Technologies
- Chip on boardChip on board
- Diebond, Pick and Place
- Die and Wire Bonding for High Frequency ApplicationsDie and Wire Bonding for High Frequency Applications
- Wire BondingWire Bonding
- Die bond solderinghttp://www.izm.fraunhofer.de/en/abteilungen/system_integrationinterconnectiontechnologies/leistungsangebot/prozess-_und_produktentwicklung/die_bond_soldering.html
Photonics
- Production of Large-core couplers Production of Large-core Couplers
- Hot embossing
- Fiber lensing
- Waveguides and Lenses Made by Ion Exchange in Thin Glass Foils Waveguides and Lenses Made by Ion Exchange in Thin Glass Foils
- Splicing Splicing
- Large diameter cleaver Large diameter cleaver
- CO2 Laser Drilling of Glass (TGV)CO2 Laser Drilling of Glass (TGV)
- Laser welding of glass fibers and glass capillaries