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Fraunhofer Institute for Reliability and Microintegration IZM
Fraunhofer Institute for Reliability and Microintegration IZM
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Manufacturing & Prototyping
Manufacturing & Prototyping
Wafer Level System Integration
Fine-pitch Bumping for Pixel Detectors
High-Density Redistribution
Wafer Bonding, Thinning, Thin Wafer Handling
Permanent Wafer to Wafer Bonding
Polymers for high-density Wiring
High Density Assembly
Glass Substrates and Layers
Sensor Development
TSV Integration
TGV Integration
Fabrication of nanoporous gold Deposits
Single Chip Bumping
Gold Stud Bumping
Thermocompression Bonding
System Integration & Interconnection Technologies
Chip on board
Diebond, Pick and Place
Die and Wire Bonding for High Frequency Applications
Wire Bonding
Die bond soldering
http://www.izm.fraunhofer.de/en/abteilungen/system_integrationinterconnectiontechnologies/leistungsangebot/prozess-_und_produktentwicklung/die_bond_soldering.html
Start-a-Factory
Photonics
Production of Large-core couplers
Hot embossing
Fiber lensing
Waveguides and Lenses Made by Ion Exchange in Thin Glass Foils
Splicing
Large diameter cleaver
CO2 Laser Drilling of Glass (TGV)
Laser welding of glass fibers and glass capillaries