Fraunhofer Institute for Reliability and Microintegration IZMManufacturing & Prototyping
Wafer Level System Integration
- Fine-pitch Bumping for Pixel Detectors
- High-Density Redistribution
- Wafer Bonding, Thinning, Thin Wafer Handling
- Permanent Wafer to Wafer Bonding
- Polymers for high-density Wiring
- High Density Assembly
- Glass Substrates and Layers
- Sensor Development
- TSV Integration
- TGV Integration
- Fabrication of nanoporous gold Deposits
- Single Chip Bumping
- Gold Stud Bumping
- Thermocompression Bonding