Fraunhofer Institute for Reliability and Microintegration IZMWafer Level System Integration
- Fine-pitch Bumping for Pixel DetectorsFine-pitch Bumping for Pixel Detectors
- Electroless Nickel Bumping
- High-Density RedistributionHigh-Density Redistribution
- Wafer Bonding, Thinning, Thin Wafer HandlingWafer Bonding, Thinning, Thin Wafer Handling
- Permanent Wafer to Wafer BondingPermanent Wafer to Wafer Bonding
- Polymers for high-density WiringPolymers for high-density Wiring
- High-Density RedistributionHigh-Density Redistribution
- High Density AssemblyHigh Density Assembly
- Glass Substrates and LayersGlass Substrates and Layers
- Sensor DevelopmentSensor Development
- TSV & TGV IntegrationTSV & TGV Integration
- Fabrication of nanoporous gold Deposits) Fabrication of nanoporous gold Deposits
- Single Chip BumpingSingle Chip Bumping
- Gold Stud BumpingGold Stud Bumping
- Thermocompression BondingThermocompression Bonding