The Department Environmental and Reliability Engineering has laboratories with state-of-the-art equipment and advanced test environments at its Berlin location. In addition to a high degree of flexibility in the combination of test parameters (vibration, shock, temperature, humidity, power cycles, etc.), we offer you a broad spectrum of analysis of environmental parameters as well as simulation of the interconnection technology of your electronic applications. In addition, with the Micro Materials Testing Lab, we have a test portfolio that enables material-side predictions about the reliability of complex systems in the micro/nano range.


Active Power Cycling Lab

Quality assurance of power electronics is an essential factor in product reliability. The active power cycling test provides instant lifetime data for power modules.


Corrosion Analysis Lab

Electrochemical characterization of materials and their composites with regard to their corrosion behavior depending on the electrolyte exposure occurring in the application.


Electronics Condition Monitoring Lab

Vibrationmeasurement and testwith electronic components, if required in combination with humidity and temperature loads. Contactless vibration measurements withlaser vibrometer. In-situ monitoring of the failure of electronic components.


Micro Materials Testing Lab

Mechanical forces, temperature changes and moisture effects can impair reliability considerably. For successful optimisation of the reliability of complex systems inthe micro/nano range it is necessary to have knowledge about the failure behaviour of materials and of damage development.


Thermal & Environmental Analysis Lab

In order to characterise thermal interface materials (TIM) a system was set up for determining heat conductivity and thermal resistances dependent on compression force. Infrared imaging measurement techniques make it possible to measure temperatures without contact, and to detect errors in systems or components.

High Performance Computing Cluster

Increased demands on the robustness and durability of electronic components, as well as increasingly short innovation cycles mean that development methods are required which can lead to a reliable overall system in a short time. The use of simulation models offers the opportunity to visualise interrelationships.