Vibrationmeasurement and testwith electronic components, if required in combination with humidity and temperature loads. Contactless vibration measurements withlaser vibrometer. In-situ monitoring of the failure of electronic components.
Mechanical forces, temperature changes and moisture effects can impair reliability considerably. For successful optimisation of the reliability of complex systems inthe micro/nano range it is necessary to have knowledge about the failure behaviour of materials and of damage development.
In order to characterise thermal interface materials (TIM) a system was set up for determining heat conductivity and thermal resistances dependent on compression force. Infrared imaging measurement techniques make it possible to measure temperatures without contact, and to detect errors in systems or components.
Increased demands on the robustness and durability of electronic components, as well as increasingly short innovation cycles mean that development methods are required which can lead to a reliable overall system in a short time. The use of simulation models offers the opportunity to visualise interrelationships.