Projects

Overview

Here you will find all publicly funded projects in which Fraunhofer IZM is involved.

6GKom

6G - Image - Tech News - One of the many applications made possible by 6G’s record-breaking data rates: Collective intelligence for autonomous driving.
© Shutterstock

One terabit of data per second: This is the ambitious target set for the 6GKom project, pursued by a crack team of German research institutes and universities that are investigating the new vistas opened up by the next-generation mobile communications standard 6G. The mission of the project is to envision the fundamental hardware for communicating at frequencies above 100 GHz.

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Advanced Distributed Pilot Line for More-than-Moore Technologies

ADMONT

The European project ADMONT provides a novel approach for innovation in all sectors. It has no specific focus on particular end markets so Automotive, Aerospace, Industrial, Food Processing, Health, Safety, ICT and various other end markets can benefit. ADMONT supplies system integrators with a modular system for combining distinct technologies at wafer level while providing a vital and necessary platform for new products. This encompasses not only process technology but also design and modelling capabilities.  ADMONT aims to reduce manufacturing times for base components to 75 % and reduce system costs to 70 % of what can be achieved today. Electronics-based products will benefit from increased innovation speed and hence accelerate time to market. This will bring the benefits of innovation to the full value chain, both from a production perspective and from an end user perspective.

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APPLAUSE ECSEL

APPLAUSE - Logo

Developing packaging and interconnection technologies for the competitive production of highly integrated microelectronic and optoelectronic systems.

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Ascent+

Continued innovation and the development of new nano-electronic technologies depend on cutting-edge facilities. The ASCENT+ taps into the resources of a rich and diverse network of science and industry partners to offer open access to this vital infrastructure for nano-electronics.

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ASTROSE - VISION

Astrose - Freileitungsmonitoring - Funk-Sensornetzwerk zum Monitoring von Hoch- und Höchstspannungsleitungen
© Fraunhofer IZM

A wireless sensor network for the monitoring of high and extra high voltage power lines.

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BioSENSORIK Detecting Biomarkers in Blood

Graph-POC

image - Fraunhofer IZM | Volker Mai - researchers develop a graphene oxide-based rapid test to detect infections
© Fraunhofer IZM | Volker Mai
Fraunhofer researchers are developing graphene oxide-based biosensors to detect bacterial and viral infections within just 15 minutes.

The project is developing a biosensor for the qualitative and quantitative for fast, reliable, on-site diagnostics of bacterial, viral, and fungal infections.

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GlaRA

Section through a glass interposer
© Fraunhofer IZM
Section through a glass interposer

The GlaRa project develops a high-reliability technology platform that combines sensor systems with high-speed signal processing and high-frequency data transmission.

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HighConnect VIP+

Logo - Federal Ministry of Education and Research (BMBF)

Coupling the evanescence field between neighbouring waveguides allows the performance-dependent splitting of optical fields and opens up new design options.
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Insect Laser

image - Insektenlaser

Introducing Agriphotonics: Smart laser systems and AI-driven image recognition for a digital agriculture 4.0.

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KameRad

KameRad
© Fraunhofer IZM

The highly integrated camera-plus-radar module allows sensor systems to adapt flexibly to conditions for autonomous vehicles on the road and beyond.

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MASSTART

MASSTART Project - Logo

MASSTART aims to provide a holistic transformation to the assembly and characterization of high speed photonic transceivers towards bringing the cost down to €1/Gb/s or even lower in mass production. This will guarantee European leadership in the Photonics industry for the next decade.

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New Processes for Embedding Electronic Components in Large-Area Organic Substrates

PEKOS

Microsection
© Fraunhofer IZM
Microsection

The project is dedicated to the development of new processes and machines for a novel form of packaging in microelectronics: panel-level packaging.

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Next generation photonic biosensors

PoC-BoSens

Next generation photonic biosensors
© addDesign/Tobias Schirmer

Label free photonic sensing platforms are recently revolutioning Point of Care diagnostic methods allowing high sensitivity and high compactness needed for fast and reliable detection of infectious and autoimmune diseases . PoC BoSens is a transnational project that contributes to the development of a portable device based on an array of high sensitive photonic microresonators.

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PolPlenCam

PoC-BoSens

img - teaser plenoptische High-Speed-Kamera
© Fraunhofer IZM

Researchers at Fraunhofer IZM have teamed up with TecVenture, Optrontec Inc., and KAIST to produce an innovative and robust high-speed camera with a multi-lens and polarization filter array for images with an extended depth of focus.

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OmniConnect

Image Teaser - OmniConnect / Research News
© OFFIS e.V / Fraunhofer

Radar and passive tags can be combined to locate and connect objects in everyday life or even objects and people moving in interior contexts. The researchers on the OmniConnect project are using so-called secondary radar to share not only data about the location and movement of an object, but also additional information that can be used to connect the objects in a virtual network.

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Position II

ECSEL Joint Undertaking

Position II - ECSEL Joint Undertaking

Within the framework of the EU Position II project, 45 European companies and research institutions are working under the coordination of Phillips to integrate medical technology applications even better into digital processes through "smart" electronics.

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SaltEtch

The SaltEtch project is giving life to an innovative system for glass etching by molten salt, raising the bar for process flexibility and production precision when compared to current technologies.

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Sens4Bee

image teaser-Sense4Bees
© Micro-Sensys GmbH

Sens4Bee – Monitoring colony health with RFID sensors capturing data in beehives and on individual bees.

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SiCmodul

Embedded silicon carbide - teaser
© Fraunhofer IZM | Volker Mai
Embedded silicon carbide on the way towards series production in electromobility

Silicon carbide semiconductors, packaged for high-temperature applications, have the potential to increase switching frequencies and output substantially in future power electronics, while making them less susceptible to failure.

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Silicon Photonics Enabling Exascale Data Networks

SPeeD

Projekt - SPeeD image ohne Beschriftung
© Fraunhofer IZM

As part of SPEED, two types of 400Gb/s transceivers are being designed on silicon ICs to serve applications both between and within data centres.

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Textile Prototyping Lab

TPL

Textile Prototyping Lab
© Textile Prototyping Lab

The Textile Prototyping Lab is Germany’s first and premier open lab for high-tech textiles. With its complete prototyping infrastructure and competent interdisciplinary team, the TPL is the perfect place for sophisticated and complex textile projects.

Founded as a shared research initiative of five organizations dedicated to textile and electronics research, design, and modern business, the Textile Prototyping Lab considers itself an open, agile, and interdisciplinary space for textile prototyping. Its mission and principle is: open innovation.

As part of the project, Fraunhofer IZM developed and established a modular pop-up lab for prototyping e-textiles.

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Realizing Trustworthy Complex Systems with Wafer-Level Packaging

VE-REWAL

image teaser-Tech News - Vertrauensvolle Elektronik
© Fraunhofer IZM

May 1, 2021, was the launch day of the three-year project “Realizing Trustworthy Complex Systems with Wafer-Level Packaging - VE-REWAL”, led as a combined effort by the University of Bremen’s Institute for Theoretical Electrical Engineering and Microelectronics. The project intends to explore concepts for a platform for trustworthy electronics with a novel system partitioning approach, suitable system packaging technology, and secure communication between the system’s components. A 77GHz-Radar MIMO application was chosen as test case for a chiplet design for radar ICs, investigated in FOWLP form, as a complete assembly, and in active use.

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Moore4Medical

teaser Moore4Medicals
© Fraunhofer IZM

EU-funded project for the development of a toolbox technology platform for faster, more economical, and more impactful medical technology

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6GKom

6G - Image - Tech News - One of the many applications made possible by 6G’s record-breaking data rates: Collective intelligence for autonomous driving.
© Shutterstock

One terabit of data per second: This is the ambitious target set for the 6GKom project, pursued by a crack team of German research institutes and universities that are investigating the new vistas opened up by the next-generation mobile communications standard 6G. The mission of the project is to envision the fundamental hardware for communicating at frequencies above 100 GHz.

more info

HiBord

HiBord
© Fraunhofer IZM | Volker Mai

The HiBord project is exploring novel vehicle wiring topologies for use in highly or fully autonomous vehicles.

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KameRad

KameRad
© Fraunhofer IZM

The highly integrated camera-plus-radar module allows sensor systems to adapt flexibly to conditions for autonomous vehicles on the road and beyond.

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Condition Monitoring for Wind Turbines

AMWind

Projekt Am Wind: Zustandsüberwachung für Windkraftanlagen | Foto: H&M Ingenieurbüro GmbH&Co. KG
© H&M Ingenieurbüro GmbH&Co. KG

Making power electronics more reliable used to mean going back to the drawing board and optimizing materials, structures, and processes. For real reliability in regular operations, modern condition monitoring concepts are offering their operators a new choice.

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KorSikA

Skizze - Projekt KorSikA
© Fraunhofer IZM

The KorSikA team is adding to our current understanding of the corrosion behaviour of power electronics in offshore wind farm applications, focusing in particular on sintered joints.

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MoDeSt

Smartphones for Life? Modular Designs for Circular Products Lifecycles

image teaser flyer

Modular smartphones have the unique ability to upgrade to keep pace with technology’s progress and changing consumer habits. This gives the devices a longer useful life, which means fewer phones need to be produced and their ecological footprint can be reduced.

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