Projects

One terabit of data per second: This is the ambitious target set for the 6GKom project, pursued by a crack team of German research institutes and universities that are investigating the new vistas opened up by the next-generation mobile communications standard 6G. The mission of the project is to envision the fundamental hardware for communicating at frequencies above 100 GHz.

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Continued innovation and the development of new nano-electronic technologies depend on cutting-edge facilities. The ASCENT+ taps into the resources of a rich and diverse network of science and industry partners to offer open access to this vital infrastructure for nano-electronics.

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A wireless sensor network for the monitoring of high and extra high voltage power lines.

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OCTAPUS (Optical Circuit switched Time sensitive network architecture for high-speed Passive optical networks and next generation Ultra-dynamic & reconfigurable central office environments) is a 3.5-year long H2021 research project aiming to deliver an agile, low-cost and energy-efficient PIC technology framework that will re-architect the NGCO ecosystem, transparently upgrading its capacity to 51.2Tb/s and beyond, through an innovative optically-switched backplane and transceiver toolkit.

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PACK4EU is a CSA co-financed by the European Commission under the Horizon Europe Framework Program.

The Pack4EU project’s ambition is to help and guide the European Commission on how to finance the EU packaging industry, by:

• Federating the European Packaging industry and research institutions by building a common roadmap and common goal towards competitiveness.
• Involving the demand and the supply side, the research community and the education will create a common understanding of the situation and define the direction to take to ensure that Europe gathers the technologies and talents to gain market share and maintains its sovereignty.

Among other European Partners, Fraunhofer IZM with its activity as part of IMAPS Deutschland e.V. participates in the CSA to assess the European microelectronics packaging landscape and provide guidance for the future needs in R&D&I initiatives

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The objective of the QuantumCascade project is the design of a multispectrum MIR light source as an easily integrated system component for use in applications that work with mid-infrared light. The system should be usable without requiring particular knowledge of the complex technology behind multispectrum light sources. This makes it available for commercial enterprises from other fields, e.g. medical technology, facilitating the development of innovative systems without the risk of having to design a stable and controlled light source of this type.

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Sens4Bee – Monitoring colony health with RFID sensors capturing data in beehives and on individual bees.

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May 1, 2021, was the launch day of the three-year project “Realizing Trustworthy Complex Systems with Wafer-Level Packaging - VE-REWAL”, led as a combined effort by the University of Bremen’s Institute for Theoretical Electrical Engineering and Microelectronics. The project intends to explore concepts for a platform for trustworthy electronics with a novel system partitioning approach, suitable system packaging technology, and secure communication between the system’s components. A 77GHz-Radar MIMO application was chosen as test case for a chiplet design for radar ICs, investigated in FOWLP form, as a complete assembly, and in active use.

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EU-funded project for the development of a toolbox technology platform for faster, more economical, and more impactful medical technology

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The PREVAIL project will create a multi-hub Test and Experimentation Facility (TEF) for edge AI hardware. This infrastructure will enable a trusted, non-discriminatory test facility in Europe capable of validating high-performance, low-power edge components and technologies to support digital transformation.

Four major European Research and Technology Organizations (RTOs) have set up this consortium to build on their advanced 300mm fabrication, design, and test facilities in a coordinated and complementary fashion.

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A reliable supply with electronic components is gaining more and more strategic relevance for the industrial site Germany.
The increasing shift of IC manufacturing to regions outside Europe bears a higher risk of malicious/spy functions in components delivered by contract manufacturers (Foundries) as well as IP theft (intellectual property) with respect to the used circuit designs.
The project »Trustworthy electronics: tech-for-Trust (T4T)« aims at providing tools for accessing safe supply chains and trustworthy electronics to domestic industry.

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The joint project »Quantum computer in the solid state – Qsolid« with a duration of 5 years started on January 1st, 2022 under the leadership of the project partner Forschungszentrum Jülich (FZJ). The overall goal is the development of a more failure-corrected quantum computer based on superconductive quantum processors as well as its early integration into the existing supercomputer infrastructure at FZJ. A first demonstrator is planned to come on stream in 2024 and to be available for early tests of applications as well as benchmark investigations. In the further course of the project, the extension to a multi-processor machine is planned that will allow the use of different next generation superconductive quantum processors.

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Main goal within this project is a feasibility study to investigate the replacement of data transmission in computer tomographs currently using mechanically complex slip rings with scalable wireless data transmission. This bears the potential to enable revolutionary data rates for new sensor generations and a reduction of mechanical demands on accuracy as well as scanning duration. With a wireless solution, CT-scanner can reach a higher reliability level, potentially leading to a longer tool lifetime.

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One terabit of data per second: This is the ambitious target set for the 6GKom project, pursued by a crack team of German research institutes and universities that are investigating the new vistas opened up by the next-generation mobile communications standard 6G. The mission of the project is to envision the fundamental hardware for communicating at frequencies above 100 GHz.

more info