Key Research Areas

3D packaging on component level

To satisfy microelectronics needs for higher integration density in the future, there will be the need to go beyond planar integration of components/functional blocks on wafer or module level – the third dimension is and will be the next big thing in electronic packaging …

Reliability, evaluation, tests and optimization

Accelerated tests can be used in order to simulate the thermal, climatic and mechanical field stress of electronic assemblies. In combination with FEM- calculation a life-time prediction can be derived. Failure analysis can be used for optimization of material choice and/or technology.

Photonic packaging

Fraunhofer IZM’s research into photonics for communication and sensor systems, in which we combine optoelectronics and microoptics, has a three-fold aim: miniaturization, improving efficiency and increasing functionality.

Panel Level Packaging for System-in-Package