To satisfy microelectronics needs for higher integration density in the future, there will be the need to go beyond planar integration of components/functional blocks on wafer or module level – the third dimension is and will be the next big thing in electronic packaging …
For the realization of electronic systems three different technological approaches are available; integration on a chip (More More) or in a component (More than Moore) as well as the integration in a package (system-in-package or heterogeneous integration).
Accelerated tests can be used in order to simulate the thermal, climatic and mechanical field stresss of electronic assemblies. In combination with FEM- calculation a life-time prediction can be derived. Failure analysis can be used for optimization of material choice and/or technology.
In the research area "Multifunctional Board" Fraunhofer IZM works on technologies and methods for integrating komponents on and into organic carriers. The aim is to achieve the highest possible degree of integration on cost-effective organic carriers as well as the integration of added functions on PCB-based systems.
Besides traditional die attach soldering and Al heavy wire bonding, new packaging concepts are pursued to build power electronics systems designed to provide improved thermal performance and higher reliability. By replacing the wire bond with an area contact on both sides of the chips the thermal performance can be improved.
Fraunhofer IZM’s research into photonics for communication and sensor systems, in which we combine optoelectronics and microoptics, has a three-fold aim: miniaturization, improving efficiency and increasing functionality.
With the trend to customize electronic modules for specific applications, there is a need for integration technologies in new materials which are new in microsystem technologies. Materials like paper or lignin can be required due to ecological reasons or for applications in wood and paper industry.