Working Groups

Chip- und Wire-Bonding

Head: Dr. rer. nat. Martin Hempel

Embedding and Substrates

Head: Dr. Andreas Ostmann

Assembly and Encapsulation

Head: Karl-Friedrich Becker

Optical Interconnection Technology

Head: Dr.-Ing. Henning Schröder

System-on-Flex

Head: Christine Kallmayer

Metallic Interconnection Technologies

Head: Dr.-Ing. Matthias Hutter

Photonic & Plasmonic Systems

Head: Dr. Tolga Tekin

Power Electronic Systems

Head: Prof. Eckart Hoene