Working Groups

Embedding and Substrates

Head: Lars Böttcher

Assembly and Encapsulation

Head:

Karl-Friedrich Becker

Dr. Tanja Braun

Optical Interconnection Technology

Head: Dr.-Ing. Henning Schröder

System-on-Flex

Head:

Christine Kallmayer

Malte v. Krshiwoblozki

Metallic Interconnection Technologies

Head: Dr.-Ing. Matthias Hutter

Power Electronic Systems

Head: Prof. Eckart Hoene

Technologies for Bioelectronics

Head: Dr. Vasiliki Giagka