Award

Tech News

San Francisco / July 20, 2016

The Fraunhofer cluster 3D Integration headed by the Fraunhofer IZM-ASSID institute has won the coveted “2016 3D InCites Award for Excellence in 3D Packaging Technologies” in the “Research Institute of the Year” category at this year’s SEMICON West expo.

Fraunhofer Cluster 3D Integration honored with the InCites Award
M. Jürgen Wolf, Chairman of the Fraunhofer-Cluster 3D Integration (left), together with other 2016 3D Incites Award winners

Beating the other high-profile candidates Leti (France) and IME (Singapore), the cluster and its constituent institutes IZM-ASSID, ENAS, IKTS, IIS/EAS, and IPMS gained international recognition for the exceptional research achievements in the field of wafer-level 3D system integration. The cluster’s chairman M. Jürgen Wolf received the award on behalf of the cluster on 12 July 2016.