Online-Sessions  /  February 10, 2026  -  March 10, 2026, 16:00 - 16:45 CET

Industry-oriented research for the commercialization of photonic packaging

Organic substrates will reach their limits in terms of the possibility of reaching line space electrical interconnections below 5 µm. For this and many other reasons, glass is currently establishing itself as the substrate material of the future.

However, switching to glass alone will not solve all future challenges. Rising energy consumption, challenges in heat dissipation, and latency problems can only be solved by switching to optical signal transmission.

The high transmission of glass over a wide wavelength range makes it ideal for integrated optical waveguides. However, photonic packaging still faces several challenges before it can be adopted for mass production.

Photonic integration technologies for your individual need

Fraunhofer IZM is researching industry-oriented solutions to these challenges and will present some of them in this series of online seminars:

  1. How Photonic Wire Bonds can bridge the gaps in photonic packages
  2. Strategies for passive and active alignment
  3. Technology for integrated photonics for the next generation of Glass Core Substrates

Fraunhofer IZM has built up abroad know-how and portfolio in photonic packaging. Especially in and on glass solutions are developed. These are constantly being further developed in publicly funded research projects and industrial projects with the latest applications from the fields of datacom, sensor technology, and quantum packaging. For this purpose, we are always looking for partners and customers.

Join our three expert sessions! 

  1. Tuesday, February 10th, 4:00-4:45 p.m.
    Photonic Wire Bonding: Bridging the Gaps in Photonic Packaging
    Expert: Dr. Wojciech Lewoczko-Adamczyk

  2. Tuesday, February 24th, 4:00-4:45 p.m.
    Passive vs. Active Alignment - Strategies in Photonic Assembly
    Expert: Dr. Gunnar Böttger

  3. Tuesday, March 10th, 4:00-4:45 p.m.
    Integrated Photonics for the Next Generation of Glass Core Substrates
    Expert: Julian Schwietering