Advanced Packaging is increasingly shaping the future of microelectronics
October 19th, 2o26
The crucial question for Europe’s competitiveness in microelectronics is no longer merely where chips are developed and manufactured, but rather where and how they are integrated.
Along with a brief introduction to Fraunhofer IZMs department »All Silicon System Integration Dresden - ASSID«, Dr. Manuela Junghähnel explains the implications and opportunities for the IZM-ASSID arising from the fact that advanced packaging is becoming key to future technologies.