Fraunhofer IZM Branch Lab for High-Frequency Sensors & High-Speed Systems

At Fraunhofer IZM in Cottbus we work on the development of miniaturized and scalable high frequency radar sensors, proximity sensors and high-speed systems for sensing, communication (5G, 6G) and computing, specifically in the following application areas:

  • Medical & Healthcare
  • Hardware Security & Civil Security
  • Smart Farming, Smart City & Smart Factory

We design, test, characterize and optimize new configurations of sensors and high-speed systems as well as their integrated components (e.g. antennas) and electronic packaging platforms from 100 MHz to 500 GHz using our holistic design approach, the M3-approach (methodologies, models, measures). Unlike conventional design methods, the M3-approach enables systematic derivation, and implementation of reliable application-specific design measures right at the beginning of the development process. These measures take into account the impact of a wide range of factors (e.g. application environment, packaging technologies and manufacturing tolerances) that affect system functionality, performance, reliability and cost. Consequently, our M3-approach leads to optimized and cost-effective development of systems, components and electronic packaging platforms without multiple re-design iterations (First-Time-Right).

We look forward to having you as our cooperation partner.

We provide research and development services at system, component and electronic packaging levels.

These services include application-specific design, test, characterization and optimization of the following high-frequency systems, system components and packaging platforms from 100 MHz to 500 GHz using our M3-approach (methodologies, models, measures):

  • High Frequency Systems
    • Radar sensors (e.g. FMCW, UWB, MIMO) and proximity sensors at microwave, millimeter-wave (mmWave) and terahertz (THz) frequencies
    • Energy-efficient frontend modules of WiFi, 5G mmWave and future 6G THz systems in user equipment (UE) and end systems/devices for wireless communication
    • Joint sensing and communication (SensCom) systems, specifically joint radar and communication (RadCom) systems
  • System Components
    • Antenna-in-Package (AiP) and Antenna-on-Package (AoP) as well as planar, 3D and MIMO antenna arrays on chip, package and board
    • Passive components such as baluns, resonators, inductors, filters and power dividers
    • Noise suppression/filtering components such as electromagnetic bandgap (EBG) and photonic band gap (PBG) structures
  • High Frequency & High-speed Electronic Packaging Platforms
    • Development of new configurations of advanced packaging platforms for system-integration of high-frequency radar sensors and high-speed modules, considering RF, fabrication, thermal and thermo-mechanical reliability requirements
    • Signal/power integrity and EMC design of high-speed and energy-efficient links in 2D/3D high-speed electronic packaging platforms with integrated processor ICs, memories and chiplets for high-performance computing and artificial intelligence (AI)

We apply a wide range of system-level simulators, electromagnetic field simulators, circuit simulators and layout tools to perform in-depth high-frequency and high-speed design, layout, characterization and optimization at system, component and packaging-levels.

State-of-the-art measurement equipment is used for testing and experimental verification in time and frequency-domains.

We collaborate directly (one-to-one) with industry partners, and work in consortiums with academic and industry partners in publicly funded research projects, e.g. projects funded by the State of Brandenburg, German Federal Ministries and the European Union.

We also work very closely with Brandenburg University of Technology (BTU) Cottbus-Senftenberg, Institute for High Performance Microelectronics (IHP), Ferdinand-Braun-Institute (FBH) and Fraunhofer Institute for Photonic Microsystems (IPMS) within the Framework of the project Innovationscampus Elektronik und Mikrosensorik (iCampus) Cottbus.

iCampus teaser image

BTU Cottbus-Senftenberg


Brandenburg University of Technology Cottbus-Senftenberg