Fraunhofer IZM Branch Lab for High-Frequency Sensors & High-Speed Systems

R&D activities at Fraunhofer IZM in Cottbus concentrate on the development of cost-effective, miniaturized and application-specific high-frequency sensors and high-speed systems as well as on the investigation of novel millimeter-wave and terahertz packaging solutions for these systems.

We focus on two main areas, namely:

  • Radar and proximity sensor systems including their components, for the following application fields:
    • Medical & Healthcare
    • Industrial Automation
    • Smart Farming
    • Security
  • High-speed modules, packages and boards for communication and computing, specifically:
    • Antenna-in-Package (AiP) based RF frontend modules for wireless communication interfaces (e.g. for 5G, 6G) of end devices and systems in the above mentioned application fields
    • High-speed interposers and System-in-Package (SiP) modules in accelerator cards for high-performance computing (HPC), artificial intelligence (AI) and Big Data workloads
    • High-speed boards with PCI-Express interface (e.g. PCIe 5.0) for multi gigabit-per-second (Gbit/s) data communication in HPC and AI based systems

We apply our holistic design approach (M3-approach), to systematically design, test and optimize these application-specific sensor systems, high-speed modules, packages and boards up to 170 GHz.

Since our unique design approach enables the impact of a variety of factors (e.g. the application environment, packaging technologies and fabrication tolerances) to be considered right at the beginning of the design phase, multiple re-design iterations can be prevented. This leads to significant reduction in the development time and cost.

Our team works hand-in-hand with industry partners (from SMEs to global players) to provide innovative, custom-tailored and cost-effective solutions that meet their needs.

We look forward to welcoming you as our collaboration partner.

We collaborate directly (one-to-one) with industry partners, and work in consortiums with academic and industry partners in publicly funded research projects, e.g. projects funded by the State of Brandenburg, German Federal Ministries and the European Union.

We also work very closely with Brandenburg University of Technology (BTU) Cottbus-Senftenberg, Institute for High Performance Microelectronics (IHP), Ferdinand-Braun-Institute (FBH) and Fraunhofer Institute for Photonic Microsystems (IPMS) within the Framework of the project Innovationscampus Elektronik und Mikrosensorik (iCampus) Cottbus.

iCampus teaser image

BTU Cottbus-Senftenberg


Brandenburg University of Technology Cottbus-Senftenberg