From February 26 – 28, 2019 Fraunhofer IZM will be presenting current trends in sensor integration at the embedded world industrial fair in Nürnberg. We look forward to welcoming you at the joint Fraunhofer booth 4-470!
more info
Fraunhofer IZM will be presenting its entire range of services from in the realm of power electronics at PCIM 2019 – covering everything from system design and packaging technologies for power electronics up to reliability aspects and cooling concepts.
more info
We cordially invite you to visit Fraunhofer IZM in Hall 4! There you will find the latest trends in electronic packaging, smart system integration and reliability analyses from our laboratories.
more info
PLATE (Product Lifetimes and the Environment), the 3rd international conference to address product lifetimes in the context of sustainability will be held September 18-20, 2019 in Berlin, Germany, organised by Fraunhofer IZM in cooperation with Technische Universität Berlin.
more info
The conference is the largest German-language event in electronic and microsystems and is an important platform for networking, particularly for small and medium-sized enterprises.
more info
Fraunhofer Institute for Reliability and Microintegration IZM