Events

FLEX – Technology Summit is a vibrant networking event designed to foster community building. Connect with like-minded professionals, share ideas, and forge lasting relationships that will drive the industry forward.

Visit us from March 10 to 12, 2026, at embedded world in Nuremberg, Germany! At the Fraunhofer joint booth, Fraunhofer IZM will present its latest research results on sensor packaging, sensor development, and sensor networks.

At CIPS 2026 we will be showcasing Fraunhofer IZM’s expertise in the realms of system design, advanced packaging concepts and reliability and test for power electronics.

The Electronic Components and Technology Conference (ECTC) is one of the leading international events in the area of packaging, components, and microelectronic systems technology.

Fraunhofer IZM will be presenting technological highlights at PCIM 2026 (Power Conversion Intelligent Motion) in Nuremberg from June 9-11, 2026. The PCIM is the world's leading trade fair on the topics of power electronics, intelligent drive technology, renewable energies as well as energy management.

Visit us at SENSOR+TEST in Nuremberg from June 9 to 11, 2026! At the Fraunhofer joint booth, Fraunhofer IZM will present innovative hardware concepts and energy-efficient solutions for highly miniaturized sensor systems (green ICT) and radar sensor technology. We will also showcase the latest research results on advanced packaging, smart system integration, and photonics in thin glass at the panel/wafer level.

Silicon Saxony Days is one of the most important international high-tech and networking events in Europe. It offers cross-industry insights into technologies and solutions in the areas of hardware, software and connectivity. In addition to knowledge and technology transfer, the goal of this networking event is the open exchange between developers, producers and users of information and communication technologies (ICT).

The 3D & Systems Summit 2026 brings together leading players in the semiconductor industry to discuss innovative strategies for resilient European microelectronics.