Under the motto „Expanding Application Space“ this year’s edition of the European 3D & Systems Summit will continue to explore the most relevant and advanced topics related to the 3D packaging roadmaps, heterogeneous integration and system-In-package (SiP) manufacturing.
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The Photonics West is the most influential conference for biophotonics and biomedical optics, high-power laser manufacturing, optoelectronics, microfabrication, and green photonics.
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The embedded world is the leading international fair for embedded systems and will take place at Messezentrum Nuremberg from February 25 to 25, 2020.
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Fraunhofer IZM will be presenting its entire range of services from in the realm of power electronics at PCIM 2019 – covering everything from system design and packaging technologies for power electronics up to reliability aspects and cooling concepts.
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We cordially invite you to visit Fraunhofer IZM in Hall 5! There you will find the latest trends in electronic packaging, smart system integration and reliability analyses from our laboratories. Have a look at the newest applications in power electronics, assembly and interconnection technologies.
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Fraunhofer Institute for Reliability and Microintegration IZM