Events

In order to bring the costs down to €1/Gb/s or even lower in mass production, a holistic transformation to the assembly and characterization of high-speed photonic transceivers is required.

System integration combines several components from different semiconductor technologies in order to use their best properties. Components for analog and digital signal and data processing, communication or sensors can be integrated into extremely small and powerful systems.

IWLPC is now in its 17th successful year as a well-established international conference, boasting annual representation from over 19 countries. The technical program and exhibition focus on semiconductor packaging and advanced wafer-level packaging technology featuring 3 tracks in WLP, 3D Integration, and Advanced Manufacturing and Test.