• Teaser - The 53rd International Symposium on Microelectronics, IMAPS 2020

    System integration combines several components from different semiconductor technologies in order to use their best properties. Components for analog and digital signal and data processing, communication or sensors can be integrated into extremely small and powerful systems.

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  • Online Event / United States /  October 29, 2020, 8:30am PST

    From Wafer to Panel Level Packaging

    IWLPC is now in its 17th successful year as a well-established international conference, boasting annual representation from over 19 countries. The technical program and exhibition focus on semiconductor packaging and advanced wafer-level packaging technology featuring 3 tracks in WLP, 3D Integration, and Advanced Manufacturing and Test.

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