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  • Fraunhofer IZM / 06/20/2018 - 06/22/2018, 11/07/2018 - 11/09/2018

    Compact Wirebonding Seminar

    tutorial Kompaktseminar drahtbondtechnologie
    © Fraunhofer IZM

    The Workshop offers you substantial technological know-how, from the basics to invaluable network and insider knowledge. No matter where you are coming from – chip-on-board technology, power modules, high frequency technology, microsystems, or other areas where wirebonding is becoming a gatekeeper technology for your business – your questions will be valued and answered here.

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  • Messe Nürnberg / 06/26/2018 - 06/28/2018

    SENSOR+TEST 2018

    From June 26 - June 28, 2018 the International Trade Fair SENSOR + TEST will be taking place in Nürnberg. The trade fair with the concurrent conferences is considered one of the leading events in sensorics, measuring and testing technologies in the world.

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  • Aalborg University, Aalborg, Denmark / 10/08/2018 - 10/10/2018

    Modern Power Semiconductors and their Packaging

    MODERN POWER SEMICONDUCTORS AND THEIR PACKAGING Fraunhofer IZM | Volker Mai
    © Fraunhofer IZM | Volker Mai

    The main component of modern power electronics circuits is the semiconductor power switch. This course presents the fundamentals of power switches operations from a physical point of view, together with the specific peculiarities and the reason to use them in a special application.

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  • Fraunhofer IZM / 10/17/2018

    Wafer Level Packaging & Sensor Integration

    © Fraunhofer IZM

    54 | | 55 Wafer level packaging is a synonym for the whole technology spectrum enabling direct chip attachment on PWB or other substrates by flip chip interconnection.

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  • Fraunhofer IZM / 10/18/2018

    Conformable Electronics

    CONFORMABLE ELECTRONICS
    © Fraunhofer IZM

    Conformable electronics offers an enticing inroad into the world of dynamically formable, structural, three-dimensional electronics constructed with conventional planar processes.

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  • Fraunhofer IZM / 10/21/2018 - 10/27/2018, t.b.d.

    Polymer Ageing and Microelectronic Package Reliabilty

    Workshop – Polymer Ageing and  Microelectronic Package Reliabilty | Fraunhofer IZM
    © Fraunhofer IZM

    Many electronic products used in different applications, such as automotive or medical but even consumer are exposed to extreme loading profiles as high temperatures, random vibrations or humid and or wet environments.

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  • Fraunhofer IZM / 11/08/2018 - 11/09/2018

    Reliability Assessment of Electronic Systems

    Workshop  Reliability Assessment  of Electronic Systems | Micro People | Fraunhofer IZM
    © Fraunhofer IZM

    The tutorial is organized by the Institute’s Department of Environmental and Reliability Engineering, which supports new technologies on their path towards full commercial maturity.

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  • t.b.d. / 11/26/2018 - 11/30/2018, t.b.d.

    Wide-Bandgap User Training

    NEW TRENDS AND TECHNOLOGIES IN ADVANCED PACKAGING
    © Fraunhofer IZM | Volker Mai

    Wide-bandgap-semiconductors (WBG) are the next generation of power electronics. This tutorial was initially prepared in the framework of the CLINT-WPE project to convey practical know-how to engineers working with SiC and GaN devices.

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  • Fraunhofer IZM / 11/27/2018

    Status & Future of Electronic Packaging

    25 Jahre Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM

    This year, Fraunhofer IZM is celebrating its silver anniversary. Since its foundation in 1993, the institute has become a world leader in the development of innovative microelectronic packaging and miniaturization technologies for a wide range of applications.

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