Events

Fraunhofer IZM is designing the fabric of the future: wearable, washable, and equipped with sensors. Wearable electronics will be on display at Techtextil, the leading international trade fair for technical textiles, at the Fraunhofer Textile Alliance's joint booth.

The Electronic Components and Technology Conference (ECTC) is one of the leading international events in the area of packaging, components, and microelectronic systems technology.

Fraunhofer IZM will be presenting technological highlights at PCIM 2026 (Power Conversion Intelligent Motion) in Nuremberg from June 9-11, 2026. The PCIM is the world's leading trade fair on the topics of power electronics, intelligent drive technology, renewable energies as well as energy management.

Visit us at SENSOR+TEST in Nuremberg from June 9 to 11, 2026! At the Fraunhofer joint booth, Fraunhofer IZM will present innovative hardware concepts and energy-efficient solutions for highly miniaturized sensor systems (green ICT) and radar sensor technology. We will also showcase the latest research results on advanced packaging, smart system integration, and photonics in thin glass at the panel/wafer level.

Silicon Saxony Days is one of the most important international high-tech and networking events in Europe. It offers cross-industry insights into technologies and solutions in the areas of hardware, software and connectivity. In addition to knowledge and technology transfer, the goal of this networking event is the open exchange between developers, producers and users of information and communication technologies (ICT).

The 3D & Systems Summit 2026 brings together leading players in the semiconductor industry to discuss innovative strategies for resilient European microelectronics.

EuMW is where academia meets industry. It provides access to the very latest products, research and initiatives in the microwave sector. It also offers you the opportunity for face-to-face interaction with those driving the future of microwave technology.

SEMICON West brings together the diverse global electronics supply chain to address the biggest opportunities and changes in the semiconductor ecosystem. The Fraunhofer IZM-ASSID will be presenting its innovations at the German Pavilion booth. The trade fair takes place from October 13 to 15, 2026 in San Francisco, CA (USA).

Electronics RESHAPED is the leading global event for the future of electronics, bringing together cutting edge innovations in additive, printed, flexible, sustainable, hybrid, wearable, and 3D electronics. It unites industry experts, researchers, and manufacturers to showcase breakthroughs and forge new collaborations.

Fraunhofer IZM-ASSID, together with Fraunhofer ENAS and IPMS as part of the Research Fab Microelectronics Germany, will exhibit at this year's SEMICON Europa. With 33 exhibitors covering 288 m², the Silicon Saxony joint booth is the largest booth at the trade fair.