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  • Fraunhofer IZM / 02/18/2018 - 02/28/2018, t.b.d.

    PhoxLab: Independent Platform for Photonics 
in Data Centers

    Fraunhofer IZM | Volker Mai | www.volker-mai.de | INDEPENDENT PLATFORM FOR PHOTONICS IN DATA CENTERS
    © Photo Fraunhofer IZM | Volker Mai

    PhoxLab is an independent neutral Platform for benchmarking and showcasing of photonics components and solutions for different hierarchy levels (on-chip, chip-to-chip, board-to-board, rack-to-rack) in Data Centers, which has the mission to sustain the results of various European projects.

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  • Fraunhofer IZM / 03/14/2018 - 03/16/2018, 11/28/2018 - 11/30/2018

    Bare-Die Processing and Assembly in Flip-Chip and Die-Attach Technologies

    Lab Course Bare-Die-Verarbeitung und -Montage in Flip-Chip- und Die-Attach-Technologie
    © Photo Fraunhofer IZM

    Flip-chip technology allows the shortest signal paths at maximum miniaturization for highest productivity through the simultaneous connection of all contacts. Every process has its very unique challenges, lying in the enormous variety of possible substrates, metallization, and component design differences, especially in semiconductors.

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  • Fraunhofer Institute for for Reliability and Microintegration IZM / 03/20/2018

    Customized Silicon-Based 
Sensors

    Tutorial  Customized Silicon-Based 
Sensors
    © Photo Fraunhofer IZM

    This tutorial showcases the project and the new opportunities it offers for its partners in industry. You will be introduced to the basics of custom application-specific 
silicon sensors by analyzing an acceleration pressure 
sensor.

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  • Fraunhofer IZM / 03/25/2018 - 03/31/2018, t.b.d.

    Combined COB-SMT Assembly Processes

    Drahtbonden gestapelter ICs Wirebonding of Stacked IC "High-Density Capacitive Interface for 3D System Integration"
    © Photo Fraunhofer IZM

    Chip-on-bard technology for placing bare dies (naked chips) is used in combination with the surface mounting of passive components or packaged dies.

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  • NEW TRENDS AND TECHNOLOGIES IN ADVANCED PACKAGING
    © Photo Fraunhofer IZM

    New device technologies and applications with their ever increasing performance and functionality are driving the requirements and innovation for assembly and packaging. The technology boundaries between semiconductor technology, packaging and system design are becoming blurred.

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  • Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM / 04/22/2018 - 04/30/2018

    Low-Cost Packaging-Platform for photonic components

    Low-Cost Packaging- 
Platform for photonic components | i-stock 536657616
    © Photo i-stock 536657616

    Demand for elastic optical data communication networks and their constituent elements is set to increase for the foreseeable future. Different avenues are being pursued in the construction of the required components to cover the need for ever greater bandwidth.

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