Events

From September 20 to 24, 2026, Málaga will host the European Conference on Optical Communications (ECOC), the most prestigious event for optical communications in Europe and the second largest worldwide.

FIRST is a high-level trend forum for those who turn technology into industrial leadership. Semiconductors are the foundation of economic resilience, technological sovereignty, security, and sustainable growth. With initiatives such as the EU Chips Act and Germany’s Hightech Agenda, the strategic importance of European microelectronics is greater than ever.

EuMW is where academia meets industry. It provides access to the very latest products, research and initiatives in the microwave sector. It also offers you the opportunity for face-to-face interaction with those driving the future of microwave technology.

Three intensive days at EFX in Stuttgart offer valuable insights into modern and future electronics manufacturing. Topics include smart manufacturing, artificial intelligence, data analysis, advanced packaging and miniaturization, supply chain resilience, prototype development, automated manufacturing processes, and regional production capacities.

In October 2026, the Photonics Days Berlin Brandenburg will serve as a premier international platform for researchers, industry experts, and investors to explore the future of the photonics sector. Featuring more than 100 speakers and 25 technical sessions, the event highlights the technological synergy with this year’s partner countries, Korea and Taiwan.

SEMICON West brings together the diverse global electronics supply chain to address the biggest opportunities and changes in the semiconductor ecosystem. The Fraunhofer IZM-ASSID will be presenting its innovations at the German Pavilion booth. The trade fair takes place from October 13 to 15, 2026 in San Francisco, CA (USA).

Electronics RESHAPED is the leading global event for the future of electronics, bringing together cutting edge innovations in additive, printed, flexible, sustainable, hybrid, wearable, and 3D electronics. It unites industry experts, researchers, and manufacturers to showcase breakthroughs and forge new collaborations.

Fraunhofer IZM-ASSID, together with Fraunhofer ENAS and IPMS as part of the Research Fab Microelectronics Germany, will exhibit at this year's SEMICON Europa. With 33 exhibitors covering 288 m², the Silicon Saxony joint booth is the largest booth at the trade fair.

Visit us at SENSOR+TEST in Nuremberg from June 11 to 13, 2027! At the Fraunhofer joint booth, Fraunhofer IZM will present innovative hardware concepts and energy-efficient solutions for highly miniaturized sensor systems (green ICT) and radar sensor technology. We will also showcase the latest research results on advanced packaging, smart system integration, and photonics in thin glass at the panel/wafer level.

The Electronic Components and Technology Conference (ECTC) is one of the leading international events in the area of packaging, components, and microelectronic systems technology.