Events

The symposium is focused on high-performance, low-energy and cost and small-size optical interconnects across the different hierarchy levels in data center.

The main component of modern power electronics circuits is the semiconductor power switch. This course presents the fundamentals of power switches operations from a physical point of view, together with the specific peculiarities and the reason to use them in a special application.

54 | | 55 Wafer level packaging is a synonym for the whole technology spectrum enabling direct chip attachment on PWB or other substrates by flip chip interconnection.

Many electronic products used in different applications, such as automotive or medical but even consumer are exposed to extreme loading profiles as high temperatures, random vibrations or humid and or wet environments.

The tutorial is organized by the Institute’s Department of Environmental and Reliability Engineering, which supports new technologies on their path towards full commercial maturity.

Wide-bandgap-semiconductors (WBG) are the next generation of power electronics. This tutorial was initially prepared in the framework of the CLINT-WPE project to convey practical know-how to engineers working with SiC and GaN devices.

This year, Fraunhofer IZM is celebrating its silver anniversary. Since its foundation in 1993, the institute has become a world leader in the development of innovative microelectronic packaging and miniaturization technologies for a wide range of applications.

The Internet of Things demands novel components and system concepts that can achieve the high degree of autonomy needed in such IoT nodes, while keeping overall power consumption low in view of the sheer number of connected devices working together. The workshop addresses these challenges and explores the potential of current technology.