Events

The tutorial is organized by the Institute’s Department of Environmental and Reliability Engineering, which supports new technologies on their path towards full commercial maturity.

At electronica 2018, the world’s leading trade fair for electronics components, systems and applications. Fraunhofer IZM together with eleven other Fraunhofer institutes will be presenting a broad spectrum of research projects and findings from November 13-16 in Munich.

Wide-bandgap-semiconductors (WBG) are the next generation of power electronics. This tutorial was initially prepared in the framework of the CLINT-WPE project to convey practical know-how to engineers working with SiC and GaN devices.

This year, Fraunhofer IZM is celebrating its silver anniversary. Since its foundation in 1993, the institute has become a world leader in the development of innovative microelectronic packaging and miniaturization technologies for a wide range of applications.

Panel Level Packaging Symposium – Status update at SEMI’s 3D & Systems Summit

Many electronic products used in different applications, such as automotive or medical but even consumer are exposed to extreme loading profiles as high temperatures, random vibrations or humid and or wet environments.