Events

COMPAMED, the leading exhibition for medical technology manufacturers and developers, will again draw a crowd of technical buyers, R&D and manufacturing specialists, packaging, quality assurance, and qualification experts, and process engineers between 16 and 19 November.

The “Future Packaging” line provides a live, comprehensive demonstration of aspects along the value chain of AVT processes and technologies. In addition, actual consumption is recorded in the real-world laboratory to detect the various factors that influence the carbon footprint of component manufacturing.

Fraunhofer IZM-ASSID, together with Fraunhofer ENAS and IPMS as well as Leibniz IHP as part of the Research Fab Microelectronics Germany, will exhibit at this year's SEMICON Europa. With 53 exhibitors covering 528 m², the Silicon Saxony joint booth is the largest booth at the trade fair.