Events

Reset
  • Aalborg University, Aalborg, Denmark / 10/08/2018 - 10/10/2018

    Modern Power Semiconductors and their Packaging

    MODERN POWER SEMICONDUCTORS AND THEIR PACKAGING Fraunhofer IZM | Volker Mai
    © Fraunhofer IZM | Volker Mai

    The main component of modern power electronics circuits is the semiconductor power switch. This course presents the fundamentals of power switches operations from a physical point of view, together with the specific peculiarities and the reason to use them in a special application.

    more info
  • Fraunhofer IZM / 10/17/2018

    Wafer Level Packaging & Sensor Integration

    © Fraunhofer IZM

    54 | | 55 Wafer level packaging is a synonym for the whole technology spectrum enabling direct chip attachment on PWB or other substrates by flip chip interconnection.

    more info
  • Fraunhofer IZM / 10/21/2018 - 10/27/2018, t.b.d.

    Polymer Ageing and Microelectronic Package Reliabilty

    Workshop – Polymer Ageing and  Microelectronic Package Reliabilty | Fraunhofer IZM
    © Fraunhofer IZM

    Many electronic products used in different applications, such as automotive or medical but even consumer are exposed to extreme loading profiles as high temperatures, random vibrations or humid and or wet environments.

    more info
  • Fraunhofer IZM / 11/08/2018 - 11/09/2018

    Reliability Assessment of Electronic Systems

    Workshop  Reliability Assessment  of Electronic Systems | Micro People | Fraunhofer IZM
    © Fraunhofer IZM

    The tutorial is organized by the Institute’s Department of Environmental and Reliability Engineering, which supports new technologies on their path towards full commercial maturity.

    more info
  • t.b.d. / 11/26/2018 - 11/30/2018, t.b.d.

    Wide-Bandgap User Training

    NEW TRENDS AND TECHNOLOGIES IN ADVANCED PACKAGING
    © Fraunhofer IZM | Volker Mai

    Wide-bandgap-semiconductors (WBG) are the next generation of power electronics. This tutorial was initially prepared in the framework of the CLINT-WPE project to convey practical know-how to engineers working with SiC and GaN devices.

    more info
  • Fraunhofer IZM / 11/27/2018

    Status & Future of Electronic Packaging

    25 Jahre Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM

    This year, Fraunhofer IZM is celebrating its silver anniversary. Since its foundation in 1993, the institute has become a world leader in the development of innovative microelectronic packaging and miniaturization technologies for a wide range of applications.

    more info
  • Fraunhofer IZM / 12/09/2018 - 12/16/2018, t.b.d.

    Power-Optimized 
Electronic

    Power-Optimized 
Electronics  | Fraunhofer IZM
    © fotolia

    The Internet of Things demands novel components and system concepts that can achieve the high degree of autonomy needed in such IoT nodes, while keeping overall power consumption low in view of the sheer number of connected devices working together. The workshop addresses these challenges and explores the potential of current technology.

    more info