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  • Fraunhofer IZM / 11/29/2017

    Panel Level Packaging Symposium

    Panel Level Packaging - Fraunhofer IZM
    © Photo Fraunhofer IZM | Volker Mai

    On November 29, 2017 Fraunhofer IZM is hosting a Panel Level Packaging Symposium where renowned experts from global players in PLP will bring you up to date with current trends and developments. Register now to be part of this exciting event!

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  • Fraunhofer Institute for Reliability and Microintegration IZM / 12/06/2017

    Founders' Garage @Halle16.Berlin

    Fraunhofer IZM and CUBE invite you to join them on 6 December 2017 at the Founders' Garage @Halle16.Berlin.

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  • Fraunhofer IZM / 02/01/2018 - 02/02/2018

    Environmental Radar Sensors

    © Photo iStock 537550524

    This tutorial offers a comprehensive introduction to radar sensor technology. It introduces the necessary fundamentals of high frequency technology with particular emphasis on radar systems and outlines the functions and different applications of essential components of radar systems.

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  • Fraunhofer IZM / 02/01/2018 - 02/02/2018

    Environmental Radar 
Sensors

    Fraunhofer IZM | ENVIRONMENTAL RADAR SENSORS
    © Photo Fraunhofer IZM

    This lab course familiarizes you with the different components of a radar system in terms of their function and possible application.

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  • Fraunhofer IZM / 02/18/2018 - 02/28/2018, t.b.d.

    PhoxLab: Independent Platform for Photonics 
in Data Centers

    Fraunhofer IZM | Volker Mai | www.volker-mai.de | INDEPENDENT PLATFORM FOR PHOTONICS IN DATA CENTERS
    © Photo Fraunhofer IZM | Volker Mai

    PhoxLab is an independent neutral Platform for benchmarking and showcasing of photonics components and solutions for different hierarchy levels (on-chip, chip-to-chip, board-to-board, rack-to-rack) in Data Centers, which has the mission to sustain the results of various European projects.

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  • Fraunhofer Institute for for Reliability and Microintegration IZM / 03/20/2018

    Customized Silicon-Based 
Sensors

    This tutorial showcases the project and the new opportunities it offers for its partners in industry. You will be introduced to the basics of custom application-specific 
silicon sensors by analyzing an acceleration pressure 
sensor.

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  • Fraunhofer IZM / 03/25/2018 - 03/31/2018, t.b.d.

    Structurally Integrated Electronics

    Fraunhofer IZM | Conformable Electronics | Das Thema Conformable Electronics bietet einen attraktiven Zugang zu dynamisch verformbarer, struktureller, 3-dimensionaler Elektronik, bei der alle Prozesse planar und konventionell durchgeführt werden können und erst in einem letzten Schritt die Formgebung erfolgt.
    © Photo Fraunhofer IZM | Volker Mai

    To capture data in use, electronics systems are increasingly being integrated into mechanical structures like car tires, bridge piers, and even bone implants. This calls for an integrated design approach that adds the mechanical perspective to the traditional electronic concerns.

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