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  • Fraunhofer IZM / 11/08/2018 - 11/09/2018

    Reliability of Electronic Systems

    Workshop  Reliability Assessment  of Electronic Systems | Micro People | Fraunhofer IZM
    © Fraunhofer IZM

    The tutorial is organized by the Institute’s Department of Environmental and Reliability Engineering, which supports new technologies on their path towards full commercial maturity.

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  • Messe München / 11/13/2018 - 11/16/2018

    SEMICON 2018

    SEMICON Europa — Focus on Current Industry Needs / Logo - web

    SEMICON Europa is the largest exhibition in Europe for semiconductor, MEMS and photovoltaic equipment, materials and service suppliers. This year the fair will be taking place in Munich from November 13-16, 2018, concurrent with electronica.

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  • Messe München / 11/13/2018 - 11/16/2018

    IZM-focus on manufacturing technologies at electronica 2018

    At electronica 2018, the world’s leading trade fair for electronics components, systems and applications. Fraunhofer IZM together with eleven other Fraunhofer institutes will be presenting a broad spectrum of research projects and findings from November 13-16 in Munich.

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  • t.b.d. / 11/26/2018 - 11/30/2018, t.b.d.

    Wide-Bandgap User Training

    NEW TRENDS AND TECHNOLOGIES IN ADVANCED PACKAGING
    © Fraunhofer IZM | Volker Mai

    Wide-bandgap-semiconductors (WBG) are the next generation of power electronics. This tutorial was initially prepared in the framework of the CLINT-WPE project to convey practical know-how to engineers working with SiC and GaN devices.

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  • Fraunhofer IZM / 11/27/2018

    Status & Future of Electronic Packaging

    25 Jahre Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM

    This year, Fraunhofer IZM is celebrating its silver anniversary. Since its foundation in 1993, the institute has become a world leader in the development of innovative microelectronic packaging and miniaturization technologies for a wide range of applications.

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  • Workshop – Polymer Ageing and  Microelectronic Package Reliabilty | Fraunhofer IZM
    © Fraunhofer IZM

    Many electronic products used in different applications, such as automotive or medical but even consumer are exposed to extreme loading profiles as high temperatures, random vibrations or humid and or wet environments.

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