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  • Nürnberg / 06/05/2018 - 06/07/2018

    Fraunhofer IZM presents power highlights at PCIM Europe 2018

    Fraunhofer IZM will be presenting its entire range of services from in the realm of power electronics at PCIM 2018 – covering everything from system design and packaging technologies for power electronics up to reliability aspects and cooling concepts.

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  • Messe Nürnberg / 06/05/2018 - 06/07/2018

    Fraunhofer IZM at SMT Hybrid Packaging in Nürnberg

    We cordially invite you to visit Fraunhofer IZM in Hall 6! There you will find the latest trends in electronic packaging, smart system integration and reliability analyses from our laboratories.

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  • Fraunhofer IZM / 06/12/2018 - 06/13/2018

    Photonic Packaging: Sub-micron Assembly

    Fraunhofer IZM - 4-Kanal Mid-Board-Optical Transceiver. Die elektro-optischen Komponenten sind mittels Flip- Chiptechnik auf einem Glasinterposer aufgebaut.
    © Fraunhofer IZM | Volker Mai

    Thus the Photonics Packaging Workshop at Fraunhofer IZM Berlin focuses on such sub-micron automated assembly technologies for optoelectronic and photonic integration on board, package and device level.

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  • Fraunhofer IZM / 06/14/2018

    SMD component embedding into PCBs

    PCB EMBEDDING | Fraunhofer IZM | Volker Mai |  www.volker-mai.de
    © TU Berlin | Volker Mai

    The intention of the workshop is to provide a good understanding of the design rules and build-up options which are available in SMD embedding.

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  • Fraunhofer IZM / 06/20/2018 - 06/22/2018, 11/07/2018 - 11/09/2018

    Compact Wirebonding Seminar

    tutorial Kompaktseminar drahtbondtechnologie
    © Fraunhofer IZM

    The Workshop offers you substantial technological know-how, from the basics to invaluable network and insider knowledge. No matter where you are coming from – chip-on-board technology, power modules, high frequency technology, microsystems, or other areas where wirebonding is becoming a gatekeeper technology for your business – your questions will be valued and answered here.

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  • Aalborg University, Aalborg, Denmark / 10/08/2018 - 10/10/2018

    Modern Power Semiconductors and their Packaging

    MODERN POWER SEMICONDUCTORS AND THEIR PACKAGING Fraunhofer IZM | Volker Mai
    © Fraunhofer IZM | Volker Mai

    The main component of modern power electronics circuits is the semiconductor power switch. This course presents the fundamentals of power switches operations from a physical point of view, together with the specific peculiarities and the reason to use them in a special application.

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  • Fraunhofer IZM / 10/18/2018

    Conformable Electronics

    CONFORMABLE ELECTRONICS
    © Fraunhofer IZM

    Conformable electronics offers an enticing inroad into the world of dynamically formable, structural, three-dimensional electronics constructed with conventional planar processes.

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