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  • Messe Nürnberg / April 09, 2024 - April 11, 2024

    Fraunhofer IZM at the embedded world

    Embedded world will be coming to Nuremberg from 9 to 11 April 2024. At the world's premier expo for embedded systems, Fraunhofer IZM will be presenting its newest research into sensor packaging, sensor development, and sensor networks at a joint Fraunhofer booth.

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  • Potsdamer Platz, Berlin / April 24, 2024 - April 25, 2024, 10:00 - 16:00

    connecticum 2024

    From 24 to 25 April 2024, Fraunhofer IZM will be coming to connecticum to meet students, graduates, and young professionals. connecticum is Germany’s largest careers expo for technology, business, and IT jobs, hosted in Berlin every year in spring and autumn. Our booth will be staffed by representatives from our research teams, our management, and our admin professionals, all eager to spark a conversation with you.

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  • Logo white on black - ICCC iCampus Cottbus Conference

    The iCampus Cottbus Conference, which will take place from May 15-16, 2024, is dedicated to the role of sensor technology, MEMS & AI as key factors in structural change. The aim of the conference is to present current trends and research results in the field of microsensors for industrial applications and give the scientific community a chance to network.

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  • Exhibition / June 11, 2024 - June 13, 2024

    Fraunhofer IZM presents power highlights at PCIM Europe 2024

    image Logo - PCIM Europe

    Fraunhofer IZM will be presenting technological highlights at PCIM 2024 (Power Conversion Intelligent Motion) in Nuremberg from June 11-13, 2024. The PCIM is the world's leading trade fair on the topics of power electronics, intelligent drive technology, renewable energies as well as energy management.

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  • NürnbergMesse / June 11, 2024 - June 13, 2024

    Fraunhofer IZM at the Measurement Fair SENSOR+TEST 2024

    Sensor + Test 2024 Logo

    The SENSOR+TEST will take place in Nuremberg from June 11 to 13, 2024. Fraunhofer IZM presents innovative hardware concepts and energy-efficient solutions for highly miniaturized sensor systems (Green ICT) as well as current research results in the field of advanced packaging and system integration for smart systems.

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  • NürnbergMesse / June 11, 2024 - June 13, 2024, 09:00 - 17:00

    »Future Packaging« Joint Booth – »The Line« at SMTconnect 2024

    »Future Packaging« Joint Booth – »The Line« at SMTconnect

    See the REAL DEAL: Live Production Line since 1997
    In 2024, the »Future Packaging« line will pay particular attention to the robustness of the individual process steps in the production line. The aim is to examine how a higher degree of digitalisation and automation can make production processes more robust against disruptions and external influences and how they can react more quickly and flexibly to any changes in status or possible changes to the machines and work equipment. Organised by the Fraunhofer IZM in Berlin, the line participants and co-exhibitors will provide an insight into both the current status and future possibilities, particularly with regard to the effects on the processes used.

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  • Berlin / June 18, 2024 - June 20, 2024

    Electronics Goes Green 2024+

    Logo/teaser Electronics Goes Green

    The international Electronics Goes Green 2024+ conference is back for its seventh outing and invites participants to get involved in the world’s leading event on greener electronics. Since its inception in the year 2000, the conference hosted by Fraunhofer IZM has grown into the groundbreaking platform for innovative developments on the cyclical economy, more sustainable materials, and carbon reduction in the electronics industry. Electronics Goes Green 2024+ will take place from 18 to 20 June 2024 on site in Berlin and as a hybrid conference for participants all over the world.

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  • Berlin / September 11, 2024 - September 13, 2024

    IEEE ESTC 2024 comes to Berlin!

    Logo ESTC - Electronics System-Integration Technology Conference / in blue and black font with white background

    The 10th IEEE Electronics System-Integration Technology Conference will be taking place in Berlin from September 11-13, 2024. IEEE ESTC is the premier international event in the field of electronics packaging and system integration, including their application in industry. The conference is organized every two years in Europe and is sponsored by IEEE-EPS in association with IMAPS Europe.

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