• Dresden Hilton Hotel / 01/27/2020 - 01/29/2020

    European 3D & Systems Summit 2020

    European 3D Summit

    Under the motto „Expanding Application Space“ this year’s edition of the European 3D & Systems Summit will continue to explore the most relevant and advanced topics related to the 3D packaging roadmaps, heterogeneous integration and system-In-package (SiP) manufacturing.

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  • Messe Nürnberg / 02/25/2020 - 02/27/2020

    Fraunhofer IZM at the embedded world

    embedded world - Logo 2

    The embedded world is the leading international fair for embedded systems and will take place at Messezentrum Nuremberg from February 25 to 25, 2020.

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  • Messe Nürnberg / 05/05/2020 - 05/07/2020

    Fraunhofer IZM presents power highlights at PCIM Europe 2020

    Fraunhofer IZM will be presenting its entire range of services from in the realm of power electronics at PCIM 2019 – covering everything from system design and packaging technologies for power electronics up to reliability aspects and cooling concepts.

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  • Messe Nürnberg / 05/05/2020 - 05/07/2020


    Teaser Logo -  SMTconnect

    We cordially invite you to visit Fraunhofer IZM in Hall 5! There you will find the latest trends in electronic packaging, smart system integration and reliability analyses from our laboratories. Have a look at the newest applications in power electronics, assembly and interconnection technologies.

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