Fraunhofer IZM will be presenting its entire range of services from in the realm of power electronics at PCIM 2019 – covering everything from system design and packaging technologies for power electronics up to reliability aspects and cooling concepts.
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We cordially invite you to visit Fraunhofer IZM in Hall 4! There you will find the latest trends in electronic packaging, smart system integration and reliability analyses from our laboratories.
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"Get In The Ring" - Facing up to the challenges of future manufacturing. For the past nine years the SMTconnect in Nuremberg has set the stage for the Future Packaging live production line, organized by Fraunhofer IZM. A row of individual machines and tools, that are needed for the manufacturing of an end product. This year there are 16 companies contributing their machines as modules of the production line.
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The Electronic Components and Technology Conference (ECTC) is one of the leading international events in the area of packaging, components, and microelectronic systems technology.
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PLATE (Product Lifetimes and the Environment), the 3rd international conference to address product lifetimes in the context of sustainability will be held September 18-20, 2019 in Berlin, Germany, organised by Fraunhofer IZM in cooperation with Technische Universität Berlin.
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The conference is the largest German-language event in electronic and microsystems and is an important platform for networking, particularly for small and medium-sized enterprises.
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Fraunhofer Institute for Reliability and Microintegration IZM