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  • Messe Nürnberg / 02/26/2019 - 02/28/2019

    Fraunhofer IZM at the embedded world 2019

    embedded world – die internationale Weltleitmesse für Embedded-Systeme

    From February 26 – 28, 2019 Fraunhofer IZM will be presenting current trends in sensor integration at the embedded world industrial fair in Nürnberg. We look forward to welcoming you at the joint Fraunhofer booth 4-470!

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  • Messe Nürnberg / 05/07/2019 - 05/09/2019

    Fraunhofer IZM presents power highlights at PCIM Europe 2019

    Fraunhofer IZM will be presenting its entire range of services from in the realm of power electronics at PCIM 2019 – covering everything from system design and packaging technologies for power electronics up to reliability aspects and cooling concepts.

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  • Messe Nürnberg / 05/07/2019 - 05/09/2019

    SMT Hybrid Packaging becomes SMTconnect

    We cordially invite you to visit Fraunhofer IZM in Hall 4! There you will find the latest trends in electronic packaging, smart system integration and reliability analyses from our laboratories.

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  • Seminaris CampusHotel Berlin / 09/18/2019 - 09/20/2019

    PLATE 2019

    PLATE is an international conference that aims to address product lifetimes in the context of sustainability

    PLATE (Product Lifetimes and the Environment), the 3rd international conference to address product lifetimes in the context of sustainability will be held September 18-20, 2019 in Berlin, Germany, organised by Fraunhofer IZM in cooperation with Technische Universität Berlin.

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  • ESTREL Hotel Berlin / 10/28/2019 - 10/30/2019

    MikroSystemTechnik conference 2019

    Electronic Packaging & System Integration | 2018 | Fraunhofer Institute for Reliability and Microintegration IZM
    © Fraunhofer IZM | Volker Mai

    The conference is the largest German-language event in electronic and microsystems and is an important platform for networking, particularly for small and medium-sized enterprises.

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