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  • Online / October 28, 2021, CEST

    Events

    Abteilungen | System Integration & Interconnection Technologies | Forschungsschwerpunkte | Fan-out Wafer- und Panel Level Packaging
    © Fraunhofer IZM | Volker Mai

    This webinar will provide insights into Multi-Project Fan-out Wafer- Panel Level Packaging | Multi-project wafer processing is an established approach in semiconductor manufacturing for fast and low-cost prototyping. This idea is now transferred to fan-out wafer level packaging one of the latest trends in microelectronics packaging. Here dies from different sources or different technologies with varying thickness and size can be handled and packaged with one integration technology. This offers a path to a well adopted and advanced technology, especially for RF applications.

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  • Ludwigsburg / November 08, 2021 - November 10, 2021

    MikroSystemTechnik Kongress 2021

    The conference is the largest German-language event in electronic and microsystems and is an important platform for networking, particularly for small and medium-sized enterprises. It offers a comprehensive overview both of the current state of research and development in electronic and microsystems in Germany and of international trends.

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  • MS Teams / November 29, 2021 - December 03, 2021, 13:00 - 15:30

    »eHarsh Seminar«

    Join us for the online "eHarsh Seminar" to learn about different aspects of building high-temperature electronics and sensors. Eight Fraunhofer Institutes, among them Fraunhofer IZM, cooperate to offer you technical lectures and live demonstrations as well as a peek into their laboratories. Presentations will cover a variety of topics from sensor development and manufacturing technology to simulation and reliability testing.

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