Tech News

Reset
  • vlnr: Dr.-Ing. Hermann Oppermann (IZM), Dr. rer. nat. Norwin von Malm (ams-OSRAM), Stefan Grötsch (ams-OSRAM)
    © Deutscher Zukunftspreis | Ansgar Pudenz

    Today, Germany’s President Frank-Walter Steinmeier honored the winners of the Deutscher Zukunftspreis 2024 at a formal ceremony in Berlin. The award was presented to a team of experts led by Dr. Norwin von Malm and Stefan Grötsch from ams OSRAM and Dr. Hermann Oppermann from the Fraunhofer Institute for Reliability and Microintegration IZM for the technological implementation of their idea — an LED matrix that turns car headlights into projectors. The LED technology developed by the team opens up new possibilities for innovative designs thanks to its high-resolution light distribution and its energy efficiency.

    more info
  • Besuch des Französischen Forschungsministers Patrick Hetzel im Fraunhofer IZM
    © Fraunhofer IZM

    On November 8, Fraunhofer IZM welcomed Patrick Hetzel, the French Minister of Higher Education and Research. In addition to Institute Director Prof. Ulrike Ganesh and Rolf Aschenbrenner, Deputy Director of the Institute, Fraunhofer researchers with French roots were also present. The meeting’s objective was to continue the dialog on future-relevant key technologies such as high-performance computing, quantum electronics, hardware security and sustainability. Of particular importance were strategic considerations regarding Europe's technological sovereignty in the semiconductor sector.

    more info
  • Close up of a electric car charger with female silhouette in the background, entering the home door and locking car
    © TheSupporter - adobestock.com

    On the EnerConnect project, researchers at Fraunhofer IZM are testing bidirectional blocking gallium nitride (GaN) transistors to design a system that could be used with the next generation of active converters and rectifiers. The innovative hardware removes the need for a separate conversion stage and can achieve record 99% efficiency.

    more info
  • Schneller und günstiger sollen Zuverlässigkeitstests für Mikroelektronik in Zu- kunft durch den Einsatz von hochmodernen Simulationsansätzen werden./Cutting-edge simulation technology for faster and cheaper reliability checks for future microelectronics.
    © Fraunhofer IZM (KI-generiert)

    Before they ever hit the market, reliable microelectronic systems need to be subjected to lengthy and cost-intensive qualification tests. Coordinated by Fraunhofer IZM, a group of high-profile companies, research institutes, and universities is now working on ways to replace these tests with much faster, more flexible, and more economical simulations.

    more info
  • Best Poster Award recipient Nyake Gahein-Sama with IEEE ESTC 2024 General Chair Tanja Braun and Poster Chair Karl-Friedich Becker

    We are very pleased to announce that our colleague Nyake Gahein-Sama won the Best Poster Award at this year’s IEEE Electronics System Integration Technology Conference (ESTC 2024) in Berlin. He was recognized for his contribution on “Alignment Between Subsequent 3D Molding Layers for Optimized Performance of 3D Integrated Patch Antennas for Advanced Sensing Applications”.

    more info
  • In close dialogue about technology cooperation: Prof. Tsung-Tsong Wu (ITRI) with Erik Jung (Fraunhofer IZM)
    © Fraunhofer IZM

    High-ranking visitor from Taiwan: Prof. Tsung-Tsong Wu, Chairman of the Industrial Technology Research Institute (ITRI), met with the Institute Director, Prof. Ulrike Ganesh, and representatives of the Research Fab Microelectronics Germany (FMD) at Fraunhofer IZM on August 27, 2024. The meeting focused on the strategic direction and future cooperation between the two leading research institutes.

    more info
  • Chiplets
    © Fraunhofer IIS/EAS

    Three Fraunhofer Institutes have launched a forward-looking research initiative in Dresden: the Chiplet Center of Excellence (CCoE). Its purpose is to partner with industry to drive forward the introduction of chiplet technology. Researchers at the CCoE are working on several fronts for the automotive industry, developing the first workflows and methods for electronics design, demonstrator construction, and the evaluation of reliability.

    more info
  • Angescherter Aluminium Dickdrahtbond mit 300 μm Durchmesser auf Kupfersubstrat und gemessener Eindringhärteverteilung im Querschnit
    © Technische Universität Berlin

    To understand the quality of a wire bond with a semiconductor chip, they are subjected to shear tests at the contact point where the wire meets the chip: A chisel shears off these so-called wedges, and the necessary force and resulting damage is analyzed. To learn more about what happens during shearing, researchers from the Technical University of Berlin and Fraunhofer IZM came up with an innovative simulation of the mechanical processes at work. This allows them to understand how newer and more durable wire types affect the behavior of the material and the processes and to produce a more objective and reliable assessment of the bonding quality of such novel materials.

    more info