Fraunhofer Institute for Reliability and Microintegration IZM
The world’s most power X-ray laser, the European XFEL, was officially approved for research purposes on September 1. It took an international team — including scientists from Berlin’s Fraunhofer Institute for Reliability and Microintegration IZM — eight years to develop the new technology.
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Double the cooling effect / 2017
Higher processor performance with microchannel cooler
One of the limiting factors for the computing power of processors is the operating temperature. As part of the CarriCool project under the aegis of IBM, Fraunhofer researchers have developed a new, effective cooling method.
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The veteran Head of Department of the Fraunhofer IZM is committed to reinforcing cooperation with the Technical University of Berlin and will support Professor Klaus-Dieter Lang, the Director of the Institute, in managing the IZM operations at Dresden.
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PolyCE / 2017
A Circular Life for High-Tech Polymers
As part of the “PolyCE” project, the researchers at the Fraunhofer IZM are helping recover and reuse polymers from waste as a precious resource for new products.
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Regional launch event at the Berlin-Brandenburg partner institutes / 2017
Unveiling the “Research Factory Microelectronics Germany” in Berlin and Brandenburg
On July 6th, the Ferdinand Braun Institute, the Leibniz Institute for Ultra-High Frequency Technology, opened its doors for the regional launch of the Research Factory in Berlin-Brandenburg.
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June 28, 2017 marks the start of a new cooperation between two leading European research institutes, Leti (a research organisation of CEA Tech Grenoble) and Fraunhofer Group Microelectronics.
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Award / 2017
Researchers from Fraunhofer IZM, TU Berlin and TU Hamburg-Harburg receive the 2016 IEEE CPMT Best Journal Paper Award
The paper is based on a fundamental research project on TSVs (Through Silicon Vias) between TU Berlin, TU Hamburg-Harburg and Fraunhofer IZM Berlin, funded by DFG – Deutsche Forschungsgemeinschaft (German Research Foundation).
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Last week the PLP consortium followed up last year's successful kick-off workshop, gathering together at Fraunhofer IZM's headquarters in Wedding to push ahead the group's agenda and work packages to advance fan out panel level packaging technology across industry.
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The SOI high-pressure sensors (silicon-on-insulator) developed by the Fraunhofer Institute for Reliability and Microintegration IZM makes this exact monitoring possible for processes operating at temperatures of up to 400° centigrade. The sensor promise an exceptionally long life as well as precision and efficiency.
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Researchers at the Fraunhofer IZM have teamed up with the Technical University of Berlin and Helmholtz Institutes in Berlin and Ulm to publish a paper in the renowned Journal of Materials Chemistry A.
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