Tech News

Fraunhofer IZM and its partners on the VE-SAFE project are exploring the potential of innovative multi-sensor technology for shielding electronic systems from malicious attacks. With more than €2 million in funding sup-port from the Ministry of Education and Research, the IZM team at the Institute’s Cottbus campus are develop-ing a novel solution for hardware protection: Package-integrated high-frequency sensors and a dedicated mi-crocontroller work together in a clever hierarchical monitoring system to guard the integrity of the protected electronics.

Almost 200 international participants joined the virtual workshop "Circular product development – the secrets to design for and from recycling" on April 15, 2021, which took place within the framework of the EU project PolyCE.

In 2010, Fraunhofer IZM founded the Fraunhofer IZM-ASSID in Moritzburg, near Dresden, as an institutional site that complements the wafer level system integration activities in Berlin and involves international partners like Globalfoundries. Dr. Manuela Junghähnel started as the deputy department head and site manager in mid-April, representing the WLSI department at the Fraunhofer IZM-ASSID.

To examine the smallest units, i.e. atoms and molecules, researchers need the appropriate equipment. The sensor modules of the radiation-type pixel detectors are built at Fraunhofer IZM. These high-resolution X-ray cameras aid a variety of advanced discoveries in medicine, biology, and chemistry.

In today’s world, more and more devices are being wirelessly connected to one another with the aid of intelligent sensors. As this Internet of Things keeps growing, however, it is consuming more and more power. To address this issue, Fraunhofer’s ZEPOWEL lighthouse project has prompted the development of hardware that not only makes the sensors energy-efficient, but even enables them to save energy.

The aim of the project is to describe the shear test on heavy wire bond points (wedges) used in the quality evaluation of bond wire joints by damage mechanics models and to correlate them with real tests.

The IEEE Electronics Packaging Society (EPS) has announced the winners of the 2021 Society Major Awards, and our group leader Dr. Tanja Braun, together with Intel’s Beth Keser, was honored with their „Exceptional Technical Achievement Award“. The award is not only a recognition of Dr. Braun’s exceptional work in the field of electronic packaging, but also shows that her technical contributions to the topic have struck a chord with the jury.

A material like no other: the special properties of piezoceramics could give rise to many innovations. In the collaborative “Smart Co-Creation” project, researchers and SMEs are developing ideas and concepts for specific industries in which this piezoelectric wonder material can be usefully applied.

One of the world’s leading automotive suppliers, Marelli, has launched the first power module for electric and hybrid traction applications in motorsports. The new module was developed together with the Fraunhofer Institute for Reliability and Microintegration IZM.

In order to be able to guarantee the highest level of safety in automated driving, 3D radar modules that can be positioned relatively freely on the vehicle and integrated into a sensor network, enabling 360° all-round vision, were developed by the KoRRund project.