Tech News

Researchers at Fraunhofer IZM have joined forces with TecVenture, Optrontec Inc., and KAIST to create a high-speed camera fitted with a unique multi-lens array that can capture images with a far greater depth of field than its conventional counterparts. The miniaturized electronics make the system a good choice for efficient damage analytics in industrial use or for many research activities.

This year Fraunhofer IZM’s Dr. Tanja Braun received the "Sydney Stein Award" in recognition of not only her leadership in the microelectronics packaging industry, but also her significant technical contribution on an international level.

Fraunhofer IZM and the weißensee academy of art in Berlin have opened a unique open innovation lab for prototyping textile electronics. Fitted with the latest in high-tech equipment and machines, the Textile Prototyping Lab (TPL) can turn e-textile visions into real fabrics and garments with its interdisciplinary team of scientists and artists.

His colleagues know and appreciate him as a celebrated expert for electronics system integration and specialist for durable chip connections: Professor Klaus-Dieter Lang is retiring from his post as the long-standing and successful Director of the Fraunhofer Institute for Reliability and Microintegration IZM.

The demand for connected devices keeps growing – in particular in the Internet of Things, or IoT for short. The Fraunhofer flagship project ZEPOWEL has shown successfully how all of these sensor systems can become extremely energy efficient or even completely autonomous. The potential result: Up to 20% less carbon emissions in Germany alone.

After a long journey from Palestine and a not quite as long journey from Hamburg, the participants of the Ecodesign Learning Factory learned one lesson above all: The principles of the circular economy can be used in many different ways to make products, services, and entire business models more sustainable.

Despite the COVID-19 crisis, Fraunhofer IZM and its 17 partners on the PLC 2.0 consortium have achieved excellent results within the first year. All partners met in a virtual meeting for two days. The time difference for such world-wide meetings is a challenge, therefore several sessions have taken place over the whole day to have easy access form Asia, Europe and the US.

PhotonicLEAP, a European Horizon 2020 collaborative research project, has been awarded over €5 million Euros in funding from the European Commission to develop disruptive technologies that will drive down the cost of integrated photonic packaging and test processes.

In the design and manufacture of a wide range of electronic devices, such as smartphones and self-driving vehicles, new and expanded functionalities must constantly be accommodated in the smallest possible space. Advanced packaging – complex assembly and interconnection technology for semiconductor components – has emerged as an essential technology for the integration of photonics, optics and electronics.

The German Federal Ministry of Education and Research (BMBF) has selected four hubs across Germany to conduct research on the upcoming mobile communications generation 6G. The goal is to jointly develop innovations for the telecommunications technologies of the future.