Fraunhofer Institute for Reliability and Microintegration IZMThe annual ESTC gives representatives from science and industry a forum for presenting their work to an interested expert audience. This year, the IZM came to Dresden to showcase its exhibits in the fields of integration technologies, wafer level packaging, testing and analytics, and reliability.
more infoTech News
-
Review / 2018
ESTC 2018 – Fraunhofer IZM comes to Dresden
-
Wireless power supply / 2018
Pliable micro-batteries for wearables
There is a new technology gripping the markets of the future – technology to wear. Wearables, as they are known, are portable systems that contain sensors to collect measurement data from our bodies. Powering these sensors without wires calls for pliable batteries that can adapt to the specific material and deliver the power the system requires. Micro-batteries developed by the Fraunhofer Institute for Reliability and Microintegration IZM provide the technical foundation for this new technology trend.
more info -
This year’s ESTC Conference broke new ground with a technical workshop comprising solely female panelists. The workshop, entitled “Fan-Out Panel: Is the Industry Ready?” included leading designers and decision-makers in the packaging industry.
more info -
The new group “Technologies for Bioelectronic Medicine” will start its activities in September 2018. The aim is to develop a platform technology for electroceuticals. These are intelligent, customizable micro-implants that can target certain regions of the nervous system.
more info -
Dr. Thomas Löher and his team have been awarded the IHK Research Transfer Award for their design of an elastic circuit board.
more info -
The Berlin Center for Digital Transformation is the shared home of Berlin’s Fraunhofer Institutes for a plethora of research and development activities, ranging from information and communications technology, data processing, the realization of novel electronic systems to production technology and microelectronics.
more info -
Fraunhofer IZM has achieved another important milestone in its commitment to qualified customer-specific process development: The International Certification Group (ICG) confirms that the quality management system of the "Wafer Level System Integration" (WLSI) department is in accordance with the standard DIN EN ISO 9001:2015 and has been officially certified for “Research, development, and services in electronic packaging”.
more info -
Project Medilight / 2018
Miniaturized smart system for wound therapy
Driven by the industrial partner URGO Recherche Innovation et Développement, seven partners have worked together within the H2020 EU-funded MEDILIGHT project to translate the technology behind light stimulation treatments delivered in hospitals into a smart wearable system for the personalized light treatment of chronic wounds.
more info -
In Fraunhofer‘s lighthouse project, the development of a extremely energy-efficient and modular hardware creates the basis for a comprehensive Internet of Things.
more info -
The 2017 edition of the annual International Wafer Level Packaging Conference in San Jose, CA, has recognized the work of Dr. Wolfram Steller with not one, but two Best Paper Awards.
more info