Tech News

In May 2019, the EU’s PROMPT project was launched to tackle e-waste: the aim is to establish an independent test program to evaluate the service life of consumer goods.

Fraunhofer IZM is joining the EUROPRACTICE IC Service platform. Together, the partners are making fan-out wafer level packaging (FOWLP) for electronic devices available and affordable even in small batches.

Christoph Marczok is developing a low-inductance power module at Fraunhofer IZM that allows more power than before to be switched with the same module size.

Christoph Marczok’s paper on the subject of „Low Inductive SiC Mold Module with Direct Cooling“ is honoured with the Young Engineer Award of the PCIM Europe 2019.

The Mission of Re- FREAM is to co-explore digitally-enabled small-scale production/manufacturing systems with artists and designers and invite to tinker and experiment in an fully geared-up infrastructure and community-supportive environment.

A miniature transponder helps localize tools at manual assembly stations. Fraunhofer IZM has developed a specialized transponder in the joint NaLoSysPro project to track and record safety-critical assembly tasks in industry with precise location data.

Sensry enables small and medium-sized businesses to gain access to innovative semiconductor technologies

The translational PoC-BoSens project is committed to developing a medical diagnostics system based on optical microsensors, integrated with the expertise of the Fraunhofer Institute for Reliability and Microintegration IZM.

Dr. Vasiliki Giagka has been invited to the editorial board of Bioelectronic Medicine for her expertise in fabrication, microsystem integration and packaging for neural implants.

At the international Optical Networking and Communication Conference OFC, experts from the tele- and data communication have been discussing optical innovations and visions for the future of the industry since 40 years.