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  • © Spinver

    As part of the EU-funded PROACTIF project, 42 European partners from research and industry are collaborating with Nokia to develop a new multi-sensor system designed specifically for drones. The German consortium, led by Fraunhofer IZM, is developing an innovative multi-sensor module that automatically detects heat. This compact unit combines radar and infrared technology. The combination of short- and long-range radar with three innovative packaging technologies results in a lightweight, robust system that can detect the precise location of pockets of embers in forest fires, even beneath the tree canopy.

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  • Sensorweste/ Vest
    © Fraunhofer IZM

    It slips on like a normal vest: Fraunhofer IZM has created a smart sensor system in cooperation with the Charité and the Technical University of Berlin. The vest records a vast array of cardiovascular parameters, which an AI-based system uses to support medical diagnostics and spot potentially dangerous developments.

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  • Reusable packaging
    © PFABO

    PFABO and its innovative deposit and returns system is taking sustainability to the next level in the food industry. Its founders, Juliane and Adrian Spieker, and their team have not only developed a new type of packaging, but invented a complete system for reusable packaging that covers production, logistics, cleaning, and digital tracing. Their mission: To drastically reduce the amount of one-way packaging in the food industry and establish reusable packaging as the new normal. With the team at Start-A-Factory, which brings hardware startup entrepreneurs and researchers together at Fraunhofer IZM, the PFABO containers are made fit for the hygiene standards of the food industry - all thanks to an AI-driven monitoring system.

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  • Prof. Ivan Ndip und der Vorsitzende der International Microelectronics and Packaging Society (IMAPS) Prof. Martin Schneider-Ramelow / Prof. Ivan Ndip and the presiding chairman of the International Microelectronics and Packaging Society (IMAPS) Prof. Martin Schneider-Ramelow

    On the occasion of the 58th International Symposium on Microelectronics (IMAPS Symposium 2025) in San Diego, CA, USA, Fraunhofer IZM department head Professor Ivan Ndip was honored with the Sidney J. Stein International Award 2025 for his significant international technical contributions to the microelectronics packaging industry and his extraordinary commitment to IMAPS at the international level.

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  • Detailaufnahme eines Quantencomputers mit goldenen Komponenten und zahlreichen Kabeln. / Detailaufnahme eines Quantencomputers mit goldenen Komponenten und zahlreichen Kabeln.
    © Forschungszentrum Jülich | Sascha Kreklau

    Together with 24 German research institutions and companies, and under the coordination of Forschungszentrum Jülich, Fraunhofer IZM-ASSID is working on a complete German quantum computer based on superconducting quantum chips and with reduced error rates. Fraunhofer IZM-ASSID provides innovative packaging technologies and has developed an interposer that optimizes the connection between qubits and control electronics

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  • Zwei optische Fasern verbunden mit einem Photonic Wire Bond
    © Fraunhofer IZM

    Within the SPOC project, Fraunhofer IZM and Akhetonics are working on a fully optical quantum processor to make it more efficient and scalable with advanced packaging and interconnection technologies for its optical components.

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  • New study reveals the raw materials needed to power progress to the year 2045 / 2025

    Technology at the cutting edge - Resources at the limit

    September 02, 2025

    Jana Rückschloss
    © Sonja Och

    Which emerging technologies will need most resources by 2045? This is the question that researchers at Fraunhofer ISI and Fraunhofer IZM are trying to answer on behalf of the Germany Mineral Resource Agency DERA. In its fourth inception, the study on „Raw Materials for Emerging Technologies“ is again offering invaluable insights and recommendations for politicians, business leaders, manufacturers, scientists, and the wider public.

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