Tech News

Net Zero by 2030: That is the ambitious goal of leading IT companies for their products’ carbon emissions, calculated across the entire semiconductor value chain. On behalf of the SEMI Semiconductor Climate Consortium, researchers at Fraunhofer IZM are working on a strategic roadmap for the product carbon footprint (PCF). The PCF will become the vehicle for a realistic calculation of the carbon emissions covering the full sweep - from the production of a single semiconductor to the hardware running in major data centers.

Shri S. Krishnan, Secretary in the Indian Ministry of Electronics and Information Technology, visited Fraunhofer IZM in Berlin. The focus was on close cooperation with the Research Fab Microelectronics Germany (FMD) and valuable exchanges with host Prof. Ulrike Ganesh, Director of Fraunhofer IZM, and Prof. Ronald Freund, Director of Fraunhofer HHI.

CHASSIS: European mobility, semiconductor, and software heavyweights team up with research in joint initiative for automotive chiplet technology

As part of the EU-funded PROACTIF project, 42 European partners from research and industry are collaborating with Nokia to develop a new multi-sensor system designed specifically for drones. The German consortium, led by Fraunhofer IZM, is developing an innovative multi-sensor module that automatically detects heat. This compact unit combines radar and infrared technology. The combination of short- and long-range radar with three innovative packaging technologies results in a lightweight, robust system that can detect the precise location of pockets of embers in forest fires, even beneath the tree canopy.

Many innovative European companies working on edge AI technologies have, until now, been dependent on international supply chains. To reduce this dependence, research organizations from four EU countries – including Fraunhofer – are setting up a European pilot line for next-generation edge AI technologies.

It slips on like a normal vest: Fraunhofer IZM has created a smart sensor system in cooperation with the Charité and the Technical University of Berlin. The vest records a vast array of cardiovascular parameters, which an AI-based system uses to support medical diagnostics and spot potentially dangerous developments.

A gentle tap on the knitted lampshade is enough to switch on the light. The lamp developed by Fraunhofer IZM in cooperation with WINT Design Lab works with a revolutionary conductive ink. Visitors can find out more and try the lamp themselves at the Berlin Science Week on November 1st and 2nd.

PFABO and its innovative deposit and returns system is taking sustainability to the next level in the food industry. Its founders, Juliane and Adrian Spieker, and their team have not only developed a new type of packaging, but invented a complete system for reusable packaging that covers production, logistics, cleaning, and digital tracing. Their mission: To drastically reduce the amount of one-way packaging in the food industry and establish reusable packaging as the new normal. With the team at Start-A-Factory, which brings hardware startup entrepreneurs and researchers together at Fraunhofer IZM, the PFABO containers are made fit for the hygiene standards of the food industry - all thanks to an AI-driven monitoring system.

By sharing technological expertise on TGVs and RDL on glass, 15 leading companies are driving forward the development of glass-based substrates. The kick-off event for the Glass Panel Technology Group took place on October 1, 2025, at Fraunhofer IZM in Berlin.

On the occasion of the 58th International Symposium on Microelectronics (IMAPS Symposium 2025) in San Diego, CA, USA, Fraunhofer IZM department head Professor Ivan Ndip was honored with the Sidney J. Stein International Award 2025 for his significant international technical contributions to the microelectronics packaging industry and his extraordinary commitment to IMAPS at the international level.