Tech News

The cooperative initiative "Universal Sensor Platform" (USeP) is vivid proof of how effective project work can pay off in research and development. Scientists from several Fraunhofer Institutes contribute their specialist expertise to create a platform for innovative, highly integrated, and individually customizable IoT systems tailored to meet the practical requirements of small and medium-sized enterprises. The contribution of Fraunhofer IZM lies in the development of a sustainable and economical packaging technology for these systems. In partnership with the fellow Fraunhofer Institutes IIS, EAS, and IPMS and the industry partner GLOBALFOUNDRIES and supported with funding from the European Regional Development Fund and the Free State of Saxony, the project is using its resources to produce immediate results of real value for industrial applications. Sensry, the spin-off launched by the project partners, is set to ready and provide the resulting platform for SMEs.

Fraunhofer IZM opens a branch lab for High Frequency Sensor Systems under the leadership of Dr.-Ing. Dr.-Ing. habil. Ivan Ndip in Cottbus. Research and Development activities in the branch lab concentrate on design, test and characterization of integrated antennas, chip-package-antenna co-design as well as on system-integration solutions for the development of miniaturized high frequency sensor systems.

Working with two dedicated partners, Fraunhofer IZM is researching a completely tubeless technology in the nuEndo project supported by Germany’s Ministry of Education and Research. Their vision: a simple-to-swallow capsule, equipped with cameras and guided by an external magnetic system.

Professor Klaus-Dieter Lang, Director of Fraunhofer IZM since 2010 and professor at the Technical University of Berlin’s chair of “Nano Interconnect Technologies” since 2011, is celebrating his 65th birthday on 8 December 2019.

The Innovation Campus Electronics and Microsensorics Cottbus brings 40 re-searchers and scientists to Cottbus, where they are innovating the sensors and sensor systems of tomorrow.

Eleven students from schools all across Germany have proven their technical potential in the 2019 edition of the Invent-a-Chip competition: Under this year’s motto of “Work 4.0”, they developed and constructed their very own microelectronic systems with hardware boards and sensors – following their own designs. In addition to cash prizes, they won the opportunity to spend a day at Fraunhofer IZM and experience the Institute’s advanced research and development work in action.

A consortium of 31 European electronics packaging, optics and photonics key players, leading equipment suppliers and testing experts launched a new project, “Advanced packaging for photonics, optics and electronics for low cost manufacturing in Europe,” simply called APPLAUSE.

The hearing contact lens is a true innovations in the purest sense: In the place of a traditional speaker, we are placing a rechargeable micro-actuator invisibly onto the patient’s ear drum itself.

On November 19, Fraunhofer IZM, together with BTU, FBH, IHP and Fraunhofer IPM, will open the "Innovation Campus Electronics and Microsensors Cottbus".

Silicon carbide has been undergoing testing for several years within the research sector as a promising alternative material in the semiconductor industry. In the SiC Modul project, the power semiconductor is now to be put on the road to industrial production.