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  • Exzellente Ausbildungsqualität
    © Fraunhofer IZM

    Fraunhofer IZM has been awarded the coveted "Excellence in Vocational Training" seal by the Chamber of Commerce and Industry of Berlin (CCI Berlin). The Institute not just passed all of the required standard criteria, but also excelled in the supplementary categories and excellence criteria – testimony to the Institute’s long-standing commitment to high-class vocational training and apprenticeships.

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  • Fraunhofer-Präsident erkundet Halbleiterforschung in Dresden
    © Fraunhofer IZM-ASSID | Silvia Wolf

    Continuing last year’s whistle stop tour of Fraunhofer sites in southern Germany, the society’s new president, Professor Holger Hanselka, has come to Saxony to visit the institutes in and around the state capital of Dresden. Fraunhofer IZM-ASSID invited him into its cleanroom to experience the strong partnership between industry and research that the site has been known for in the last 15 years.

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  • Nanometer
    © Fraunhofer IZM

    Space comes at a premium on electronic chips: Powerful electronics need more and more connections, crammed into smaller and smaller spaces. Established technologies are reaching the limits of what is physically possible. Now, researchers at Fraunhofer IZM-ASSID have teamed up with other partners to level up a connection technology patented by NanoWired GmbH that uses wires at a nanometer scale. The team demonstrated how the novel technology could be used in the industrial production of 300 mm wafers.

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  • Dämpfungsmessung einer Wellenleiterspirale / Attenuation measurement of a waveguide spiral
    © Fraunhofer IZM | Volker Mai

    The use of glass as substrate in electronics manufacturing enables the additional transmission of optical signals through the substrate material. This allows much higher rates of data transmission, which is vital for many scenarios like automotive, telecommunication, or AI applications. Researchers at Fraunhofer IZM have now managed to develop a system that can automatically measure propagation losses in integrated optical waveguides, all part of the research project “Integrated Electro-Photonic Panel Systems” (EPho).

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  • IMAPS 2023 – a resounding success

    San Diego, California / October 30, 2023

    IMAPS 2023 San Diego, Kalifornien
    © www.robertkeithphoto.com

    The 56th International Symposium on Microelectronics (IMAPS 2023) took place in San Diego, California, this year, attracting nearly 800 participants from around the world. In keynote presentations, the latest developments and challenges in microelectronics were discussed.

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  • Smartphone, front and back side
    © Fraunhofer IZM | Tapani Jokinen & Robin Hoske

    One cannot imagine modern life without smartphones. These small electronic helpers make our lives easier and better. But they also do real ecological damage. How can the production and use of smartphones be brought back into a healthier balance with our environment? This is the question that two industrial designers wanted to answer at Fraunhofer IZM as part of the BMBF-funded MoDeSt project, researching whether modern technology and a circular economy can go together. As a result of their efforts, they presented two designs for long-lasting and recyclable smartphones with striking looks.

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  • patch with sensors
    © Fraunhofer IZM | Volker Mai

    Researchers from Fraunhofer IZM, together with 31 partners from industry and research, have developed a stretchable and wireless patch that can be used to make it possible to conduct diagnostically relevant cardiac monitoring in every-day life. This will reduce the number of inpatient examinations required for high-risk patients. It also boosts the semiconductor value chain for the medical sector in Europe through the development of new tools, methods and processes for series production.

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  • © Fraunhofer IZM | Volker Mai

    The largest German-speaking congress in the field of electronics and microsystems will be held in Dresden from October 23 - 25, 2023. On the occasion of the tenth anniversary, sustainability and technology sovereignty in particular will be presented in exhibits and conference contributions. Fraunhofer IZM will be presenting possible solutions for resource-efficient microsystems at the joint booth of the Forschungsfabrik Mikroelektronik Deutschland (FMD) on level 5, booth 14.

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  • banner/teaser 30 Y Fraunhofer IZM
    © Fraunhofer IZM

    The Fraunhofer Institute for Reliability and Microintegration IZM is marking its thirtieth year with a high-profile international conference in September. The Institute that now employs more than 400 people at its three sites was founded by twenty-one German scientists on a mission. Its main site in the historic architectural brickwork masterpiece in Berlin is not just a place with lots of history. With many scientific advances born here, it is the place where the future of packaging and interconnection technologies for microelectronic systems is made.

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