Fraunhofer Institute for Reliability and Microintegration IZMOn July 6th, the Ferdinand Braun Institute, the Leibniz Institute for Ultra-High Frequency Technology, opened its doors for the regional launch of the Research Factory in Berlin-Brandenburg.
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Regional launch event at the Berlin-Brandenburg partner institutes / 2017
Unveiling the “Research Factory Microelectronics Germany” in Berlin and Brandenburg
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June 28, 2017 marks the start of a new cooperation between two leading European research institutes, Leti (a research organisation of CEA Tech Grenoble) and Fraunhofer Group Microelectronics.
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Award / 2017
Researchers from Fraunhofer IZM, TU Berlin and TU Hamburg-Harburg receive the 2016 IEEE CPMT Best Journal Paper Award
The paper is based on a fundamental research project on TSVs (Through Silicon Vias) between TU Berlin, TU Hamburg-Harburg and Fraunhofer IZM Berlin, funded by DFG – Deutsche Forschungsgemeinschaft (German Research Foundation).
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Last week the PLP consortium followed up last year's successful kick-off workshop, gathering together at Fraunhofer IZM's headquarters in Wedding to push ahead the group's agenda and work packages to advance fan out panel level packaging technology across industry.
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The SOI high-pressure sensors (silicon-on-insulator) developed by the Fraunhofer Institute for Reliability and Microintegration IZM makes this exact monitoring possible for processes operating at temperatures of up to 400° centigrade. The sensor promise an exceptionally long life as well as precision and efficiency.
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Researchers at the Fraunhofer IZM have teamed up with the Technical University of Berlin and Helmholtz Institutes in Berlin and Ulm to publish a paper in the renowned Journal of Materials Chemistry A.
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After successful knee surgery, patients need to track their recovery process carefully. The MOTEX project has developed an intelligent knee sleeve to aid the patient’s recovery after complete knee transplants.
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Glass-based optical On-Board-Transceiver for >25Gb/s/ch / 2017
The world’s first hybrid integrated on-board transceiver using a glass interposer
Within the project HyPOT, Fraunhofer IZM, together with its industrial and academic partners, is developing a hybrid integrated glass-silicon based interposer for data communication at a wavelength of 850 nm
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Dr. Thomas Löher together with Stefan Karaszkiewicz, Lars Böttcher and Dr. Andreas Ostmann won Best Paper Award at the ICSJ, which was held November 7 - 9, 2016 in Kyoto. The ICSJ is organized by the “Components, Packaging and Manufacturing Technology Society” (CPMT) and is Japan’s annual IEEE CPMT symposium. It is one of the world’s leading conferences on packaging technology.
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To reinforce the position of Europe’s semiconductor and electronics industry within global competition, eleven institutes within the Fraunhofer Group for Microelectronics have, together with two institutes within the Leibniz community, come up with a concept for a cross-location research factory for microelectronics and nanoelectronics.
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