Trainings and Workshops

Overview expert session series

With the expert session series »Advanced flexible circuits for novel applications« we would like to introduce Fraunhofer IZMs know-how and capacities within this research area and show you which research results you can use for your applications/developments or as a basis for joint projects.

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This session is part of the expert session series »Advanced flexible circuits for novel applications«.

Low profile electronic packaging is a major trend in electronics industry today! High density thin film flex technology can deliver solutions to gain lower profiles and higher integration densities for advanced packaging scenarios. The expert session will give an overview of the processes and sample applications of the newest generation of thin film flex technology.

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This session is part of the expert session series »Advanced flexible circuits for novel applications«.

Conformal electronics as a new paradigm in electronic system fabrication will be presented. Such systems are build-up so that they can be deformed and stretched, and are supple to adapt to arbitray shaped and even dyamically changing surfaces. In this presentation foil based conformal electronics will be discussed. This session is part of Fraunhofer IZMs expert session series »Advanced flexible circuits for novel applications«.

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