Trainings and Workshops

Wide-bandgap-semiconductors (WBG) are the next generation of power electronics. This tutorial was initially prepared in the framework of the CLINT-WPE project to convey practical know-how to engineers working with SiC and GaN devices.

System integration combines several components from different semiconductor technologies in order to use their best properties. Components for analog and digital signal and data processing, communication or sensors can be integrated into extremely small and powerful systems.

IWLPC Professional Development Course: From Wafer to Panel Level Packaging Panel Level Packaging (PLP) is one of the latest trends in microelectronics packing. Besides technology developments towards heterogeneous integration including multiple die packaging, passive component integration in package and redistribution layer or package-on-package also approach larger substrates formats.

The tutorial is organized by the Institute’s Department of Environmental and Reliability Engineering, which supports new technologies on their path towards full commercial maturity. The course introduces the methods and backgrounds of application-specific reliability assurance processes in the development and production of electronic systems.