Trainings and Workshops

The great diversification of application scenarios leads to more highly integrated substrates in order to match a wide variety of requirements. Therefore, advanced substrates play a central role in the rapid development of the electronics industry – they make it possible to overcome the limitations of conventional printed circuit boards and create innovative solutions for complex challenges and mission profiles. Their relevance extends across various application areas and technologies that are shaping the future of electronics.

#2 SESSION OF OUR EXPERT SERIES »ADVANCED SUBSTRATES BEYOND PCB« This session is about the integration of a beamforming transceiver with GaN power amplifiers at mm-wave frequencies. It focuses on the challenges of integrating III-V semiconductor components (e.g. InP and GaN) with Si-based CMOS technologies, particularly at contact pads, air bridges and heat dissipation. A PCB-based technology developed by Fraunhofer IZM is used here to tackle these problems. Simulation-based approaches for the development of package interconnects, integrated patch antenna arrays and heat dissipation are also presented.

In the talk, we will lift the veil on the invisibles of the digital world. Based on the assessed impacts of ICT, we will question the merits of certain technological choices made in the name of the transition. A holistic, transdisciplinary and pragmatic approach must be put in place in order to think, design and innovate within the constraints of our ecosystem limits.