Trainings and Workshops

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  • Fraunhofer Institute for Reliability and Microintegration IZM /  September 21, 2020 - September 22, 2020

    Wide-Bandgap User Training

    NEW TRENDS AND TECHNOLOGIES IN ADVANCED PACKAGING
    © Fraunhofer IZM | Volker Mai

    Wide-bandgap-semiconductors (WBG) are the next generation of power electronics. This tutorial was initially prepared in the framework of the CLINT-WPE project to convey practical know-how to engineers working with SiC and GaN devices.

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  • Teaser - The 53rd International Symposium on Microelectronics, IMAPS 2020

    System integration combines several components from different semiconductor technologies in order to use their best properties. Components for analog and digital signal and data processing, communication or sensors can be integrated into extremely small and powerful systems.

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  • Online Event / United States /  October 29, 2020, 8:30am PST

    From Wafer to Panel Level Packaging

    IWLPC Professional Development Course: From Wafer to Panel Level Packaging Panel Level Packaging (PLP) is one of the latest trends in microelectronics packing. Besides technology developments towards heterogeneous integration including multiple die packaging, passive component integration in package and redistribution layer or package-on-package also approach larger substrates formats.

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  • Online /  November 26, 2020 - November 27, 2020

    Reliability of Electronic Systems

    Workshop  Reliability Assessment  of Electronic Systems | Micro People | Fraunhofer IZM
    © Fraunhofer IZM

    The tutorial is organized by the Institute’s Department of Environmental and Reliability Engineering, which supports new technologies on their path towards full commercial maturity. The course introduces the methods and backgrounds of application-specific reliability assurance processes in the development and production of electronic systems.

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