Trainings and Workshops

With increasing switching speed the internal EMC of circuits becomes more tricky to achieve. Measurement and control signals are disturbed by switching events and even the switches themselves show undesired switch on events.

It is our great pleasure to invite you to the next Symposium on »Status & Trends in Panel Level Packaging« at Fraunhofer IZM in Berlin. Join the symposium to receive latest research results on this exciting new manufacturing technology enabling.

Heterogeneous integration combines several components from different semiconductor technologies in order to use their best properties. Components for analog and digital signal and data processing, communication or sensors can be integrated into extremely small and powerful systems. Join us for this exciting event at the end of this year´s Semcion West!

Wide-bandgap-semiconductors (WBG) are the next generation of power electronics. This tutorial was initially prepared in the framework of the CLINT-WPE project to convey practical know-how to engineers working with SiC and GaN devices.