R&D activities at Fraunhofer IZM in Cottbus concentrate on the development of cost-effective, miniaturized and application-specific high-frequency sensors and high-speed systems as well as on the investigation of novel millimeter-wave and terahertz packaging solutions for these systems.
We apply our holistic design approach (M3-approach), to systematically design, test and optimize these application-specific sensor systems, high-speed modules, packages and boards up to 170 GHz.
Since our unique design approach enables the impact of a variety of factors (e.g. the application environment, packaging technologies and fabrication tolerances) to be considered right at the beginning of the design phase, multiple re-design iterations can be prevented. This leads to significant reduction in the development time and cost.
Our team works hand-in-hand with industry partners (from SMEs to global players) to provide innovative, custom-tailored and cost-effective solutions that meet their needs.
We look forward to welcoming you as our collaboration partner.