Developing a highly transparent dry film resist system ready for UV-A/VIS exposure (λ=350-450 nm) and UV structuring with variable layer thicknesses for the production of optical components
The Troop project is developing a highly transparent dry film resist for the production of optical and opto-fluidic components that is suitable for UV long-wave exposure (at (λ>365 nm and λ>405 nm) and can be lithographically structured by modern, energy-efficient sources like LED and diode-based direct laser structuring. No such material is currently available in the market, despite the obvious advantages of dry film resists over liquid resists due to the easy and time-efficient layer formation by lamination over a broad range of layer thicknesses. Without the lengthy drying time needed to remove the solvents, the process is accelerated considerably and consequently more economical. Additionally, it facilitates the bridging or sealing of any cavities or channels, opening up many new opportunities for microfluidic applications. The highly transparent optical properties of the connected dry film resist structures enable the creation of microoptical components for sensors or for coupling and decoupling light signals.