Equipment

Wire bonder:

F&K Delvotec G5:

  • G5 – 64000
  • G5 – 64000 DA (deep access)
  • G5 – 64000 Heavy Ribbon
  • Laserbonder M17LSB

Kulicke & Soffa:

  • Maxμm Ultra
  • ProCu IConn
  • Orthodyne 3600R Plus

Hesse:

  • BJ 820
  • BJ 935

 

Testing:

Pull- and sheartester Dage:

  • 4000 Plus
  • 4000
     
  • XYZTEC Condor Sigma

  • Light microscope and stereomicroscope
  • Scanning electron microscope (SEM)
  • Focused Ion Beam (FIB)
  • Roughness measurement

Ultrasonic Welding:

  • Schunk DS20-S-plus

Die bonder:

  • Finetech fineplacer
  • Hilpert HilBond db750
  • Datacon evo - apm 2200

 

Life-Time-Testing

  • Mechanical Fatigue Tests
  • Surface Analysis (Material, Roughness, Contamination)
  • Interface Analysis down to the nm-Scale
  • Failure Analysis and Reliability Studies
  • Active Power Cycling (APC)  

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Advanced Chip and Wire Bonding