Substrate integration line
- CoB laboratory (die, ribbon, wire bonding down to 35 µm pitch)
- Precision mounting laboratory (clean room, including chip-to-wafer bonder to 300 mm, thermocompression, thermosonic)
- Embedding laboratory (high-precision pick and place machine, circuit board processing line, including laser drill and laser-direct imaging)
- Optical laboratory (including hot embossing, micro-optical assembly, component and system characterization)
- Micromechatronics laboratory
- Encapsulations (conformal coating, potting, flip-chip and CoB molding, needle and jet dispensing, transfer and liquid molding, wafer-level encapsulation)
- Textile laboratory (integration of electronics in textiles)
- SMD & flip chip line (Datacon EVO, Siplace X-Placer, Asymtek Axiom Jet, Dispense System)
Fraunhofer Institute for Reliability and Microintegration IZM