Process and Product Development

Chip on Board

Wire bonding and encapsulation

Wire bonding and encapsulation

PC board (courtesy of digital design)

PC board (courtesy of digital design)

COB (chip on board) technology is often successfully applied, when bare dies must be mounted on PC boards and/or in order to achieve a higher degree of integration of either electronic circuits or microsystems. The conditions, equipment and process steps of both die- and wire-bonding technology are generally widely developed today, but continuous improvements are required due to the implemention of new materials, thinner wires, the increasing number of contacts, complex system integration processes and the request for superior reliability At Fraunhofer IZM research and service for industrial users especially address the understanding of the basics of joint formation during wire bonding, the implementation of new materials and the process control to satisfy future demand in this field.

The technological know how as well as the necessary equipment – in particular automatic die– and wire bonders and encapsulation technology - are available in the “Advanced Chip and Wire bonding” group.