Equipment

Cu-TSV Process Line at ASSID/Dresden#

800 m² cleanroom (+ 220 m² laboratory)

300 (200) mm wafer process line for wafer level 3D system integration:

  • Copper TSV technology
  • High density multilayer thin film technology (RDL)
  • Wafer thinning and handling technologies (Temporary Bond- / Debonding)
  • Wafer level bumping technologies (ECD)
  • Wafer level assembly and chip stacking