Wafer Level Packaging Line


800 m² clean room (classes 10 to 1000) + 800 m² gray room, 4’’, 6’’ and 8’’, prototyping equipment for some applications also on 300 mm

  • Thin-film deposition
  • Photolithography (including photo varnishes, polymers and spray coating)
  • Galvanic bumping, circuit tracks and through-via filling (Cu, Ni, Au, AuSn, SnAg, PbSn)
  • Wet-chemical processes (etching, cleaning)
  • Wafer bonding (support wafer, thin-wafer handling)
  • Silicon plasma etching (through vias, cavities)