Interconnect Metallurgy and Processes

Our technology portfolio includes TC and TS flip-chip and die bonding on board, package and wafer level for LEDs, optical & RF components, power electronics, 3D stacking, and hermetical sealing.

  • Lead-free reflow solders
  • Nano-alloying of solders and fluxes
  • Wetting, spreading, solidification
  • Fluxless bonding approaches
  • Ag sintering and transient liquid phase bonding
  • Porous nanosponge as compressible bonding layer
  • Reactions with barrier and wetting layers
  • Phase transformation
  • Growth of intermetallic compounds
  • Diffusion and electromigration