Trustworthy electronics: tech-for-trust (T4T)

Split Manufacturing of novel and trustworthy Electronics

A reliable supply with electronic components is gaining more and more strategic relevance for the industrial site Germany.
The increasing shift of IC manufacturing to regions outside Europe bears a higher risk of malicious/spy functions in components delivered by contract manufacturers (Foundries) as well as IP theft (intellectual property) with respect to the used circuit designs.
The project »Trustworthy electronics: tech-for-Trust (T4T)« aims at providing tools for accessing safe supply chains and trustworthy electronics to domestic industry.

Within the project, solutions are being developed that help to realize a modern system integration in Germany usable on an industrial scale.
On the one hand, needed manufacturing processes will be developed and optimized. On the other hand, design methods will be investigated that will enable small and medium enterprises to design complex electronic systems. The required interfaces, tools and processes will be tests with suitable demonstrators.
Particular attention is being paid to the aspect of trustworthiness: design and manufacturing processes will be adjusted in a way that intellectual property remains protected and forgery-proof when it comes to inter-company cooperation.

The main goals of the project lies in the realization of an reliable supply chain through split manufacturing. In contrast to existing concepts, a new approach will be developed that will unite the split- manufactured silicon components in mounting and connection technology. This will be done on wafer to wafer basis as well as in the form of chiplets. For this, relevant manufacturing technologies and a holistic design process will be developed. Furthermore, the possibility to integrate quantum secure cryptographic keys into a wafer compound during the wafer manufacturing will be realized.

Research goals with participation of IZM-ASSID within the project:

  • Development and characterization of the technology parts via wafer-to-wafer bonding that are needed for the distributed manufacturing
  • Development of the most important technological processes for the manufacturing of chiplets

Major research work of IZM-ASSID within the project:

  • Development of technological processes for the manufacturing of interposer wafers (carriers) with high-density contact areas (direct copper and micro bumps) and development of highly precise assembly processes as well as the characterization of the interconnects
  • Development of individual processes, approaches for integration, modules and procedures for the integration of a cryptographically protected memories into a chip
  • Realization of a demonstrator with chiplets mounted on an interposer

  • Robert Bosch GmbH, Gerlingen (project coordination)   
  • XFAB Dresden GmbH & Co. KG, Dresden
  • X-FAB MEMS Foundry GmbH, Erfurt
  • NanoWired GmbH, Gernsheim
  • SÜSS MicroTec AG, Garching
  • DISCO HI-TEC GmbH, Kirchheim b. München
  • Fraunhofer IZM-ASSID, Dresden
  • Fraunhofer IIS/EAS, Dresden   
  • Fraunhofer IPMS-CNT, Dresden
  • Technische Universität Dresden
  • AUDI AG, Ingolstadt
  • ams-OSRAM International GmbH, Regensburg
  • Leibniz-Institut für innovative Mikroelektronik IHP GmbH, Frankfurt/Oder
  • SIJEDA GbR, Leipzig (assoziiert)

General project information

Logo - Federal Ministry of Education and Research (BMBF)
  • duration: 03/2022 - 03/2025
  • consortium coordination: Robert Bosch GmbH, Gerlingen
  • merge of  13 companies and research institutions
  • The joint project is sponsored by the Federal Ministry of Education and Research BMBF with 11,75 Mio. €  and additionally 0,1 Mio. € so called project flat fee for involved universities.