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Science need not always be complicated or even incomprehensible! Here we want to show you that it can be done in a completely different way: easy-peasy to understand and accessible for everyone.

We talk directly to the researchers, find out how and why microelectronics works and together with you we will find answers to the big and small questions at our research institute. Backstage at Fraunhofer IZM, so to speak.

On this page you will find insights into current projects, tips from practicing researchers and everyday things from our institute - all with a little technical tic. In addition, the small µ has come to join us - as a symbol for exactly the topics that concern us at Fraunhofer IZM, it explains a term from microelectronics every month.

Do you have any questions about Fraunhofer IZM or would you like to know what is behind other technical terms? Then send us your questions by e-mail and we’ll try and find the answers for you!

 

µ knows best:
Complex terms – in simple words

 

µ is not simply the twelfth letter of the Greek alphabet. µ is a symbol for micro and is therefore an elementary quantity for us at the Fraunhofer Institute for Reliability and Microintegration IZM. With our new format "µ knows best" we also focus on the elementary facts.

Every month µ presents you with a term from the everyday work of Fraunhofer IZM and tells you what exactly it is about. How much knowledge do you have about research terms? Are there any abbreviations you always wanted to understand in research or more precisely microelectronics? What, how and why? Here you can find out everything about the topics we are working on at Fraunhofer IZM. Always available, for you to look up. Are you missing a term or do you still have questions? Let us know and µ will get on the case!

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Our monthly quiz with µ

#µknowsbest

FOWLP... what? Behind this unwieldy acronym lies a state-of-the-art technology for packaging microchips. The device you are currently reading this post on probably contains hundreds of these packages, explains Marius Adler at #µknowsbest. This is because Fan-Out Wafer Level Packaging offers mobile phone manufacturers production advantages that Fraunhofer IZM would also like to open up to other industries.

In the PUNCH project, for example, FOWLPs are being used to make our data networks faster and more reliable. Find out more on our website: Tech News - Lightning-Fast and highly reliable: Sharing Data via Photonic Integrated Circuits

#ResearchForNewcomers #FraunhoferIZMBerlin

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What does High Performance Computing mean?

For some tasks in research and industry, the computing power of a single computer is not enough. This is where high-performance computing (HPC) comes into play, enabling even complex computing operations. For example, it allows complex simulations to be carried out and data volumes to be processed that would overwhelm a conventional computer. This is achieved using particularly powerful supercomputers on the one hand, and on the other hand using so-called clusters, in which individual computers work together on a task.

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Your Career at Fraunhofer IZM

Are you interested in working in the realm of applied research? Then take a look at our current job offers here.

 

The Institute

As part of the Fraunhofer-Gesellschaft, Fraunhofer IZM specializes in applied and industrial contract research. Fraunhofer IZM’s focus is on packaging technology and the integration of multifunctional electronics into systems.