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Science need not always be complicated or even incomprehensible! Here we want to show you that it can be done in a completely different way: easy-peasy to understand and accessible for everyone.

We talk directly to the researchers, find out how and why microelectronics works and together with you we will find answers to the big and small questions at our research institute. Backstage at Fraunhofer IZM, so to speak.

On this page you will find insights into current projects, tips from practicing researchers and everyday things from our institute - all with a little technical tic. In addition, the small µ has come to join us - as a symbol for exactly the topics that concern us at Fraunhofer IZM, it explains a term from microelectronics every month.

Do you have any questions about Fraunhofer IZM or would you like to know what is behind other technical terms? Then send us your questions by e-mail and we’ll try and find the answers for you!

#Career

Robots interacting with humans in everyday situations - this is already a reality in some areas. Many of the machines use radar systems for orientation, which they use to identify people and objects. 🤖👀

In today's edition of #µfragtnach, µ OnTour is on the road in the radar chamber at Fraunhofer IZM. Niklas Kalkbrenner shows us the research topic of his master's thesis and explains how measurement methods in the chamber are used in the further development of radar systems.

Would you like to find out more about the radar chamber - or even take a look inside yourself? Then come to the #LNDW25 at Fraunhofer IZM on June 28.

Exciting insights into the world of #microelectronics await you there! For more information, follow the link below: https://ow.ly/lLYq50W7E1I

#ResearchForNewcomers #Radar #FraunhoferIZMBerlin

What is Hybrid bonding?

Hybrid bonding is a permanent connection for microelectronic components, such as wafers. The process combines a dielectric compound (oxide) with an embedded metal (in many cases copper). Hybrid bonding is mainly used for die-to-wafer (D2W) or wafer-to-wafer (W2W).

In contrast to other bonding methods, hybrid bonding offers several advantages, such as stacking of components, increased storage density, bandwidth and performance as well as improved speed efficiency.

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