Projekt - EuroPAT-MASIP
© Fraunhofer IZM

EuroPat-MASIP is committed to:

  • Modelling, designing, and simulating packaging features and challenges in the field
  • Key technologies for packaging, equipment, and materials
  • Heterogeneous (3D) integration of smart system blocks (More-than-Moore, MtM) and SIP
  • Metrology, methods and equipment, reliability, and weak spot testing procedures
Logo - Federal Ministry of Education and Research (BMBF)

Project Partners

  • Amkor Technology Portugal S.A
  • BESI Austria GmbH
  • BESI Netherlands BV
  • EV Group (EVG)
  • Murata Electronics Oy
  • Pac Tech -Packaging Technologies GmbH
  • Valeo Vision Systems (Connaught Electronics Limited)
  • 3DiS Technologies
  • RoodMicrotec
  • Sencio
  • Afore Oy
  • Micro Analog Systems Oy
  • Commissariat à l’Energie Atomique Et Aux Energies Alternatives
  • Fraunhofer Gesellschaft zur Förderung der angewandten Forschung e.V.
  • VTT Technical Research Centre of Finland Ltd
  • Advanced Vacuum
  • Packaging SiP
  • NXP Semiconductors N.V.
  • Ketek GmbH
  • Spinverse Oy
  • Nokian Tyres
  • InnoSenT
  • Berliner Nanotest und Design GmbH
  • Angewandte Micro-Messtechnik GmbH
  • Silicon Radar
  • TexEDA Design GmbH
  • Elmos Semiconductor AG

Das Institut - Übersicht

Projekte am Fraunhofer IZM