Projects

EuroPat-MASIP is committed to:

• Modelling, designing, and simulating packaging features and challenges in the field
• Key technologies for packaging, equipment, and materials
• Heterogeneous (3D) integration of smart system blocks (More-than-Moore, MtM) and SIP
• Metrology, methods and equipment, reliability, and weak spot testing procedures

Duration: 04/01/2017 - 03/31/2020

Funding reference number: 737497

Project website: https://www.europat-masip.eu

• Amkor Technology Portugal S.A
• BESI Austria GmbH
• BESI Netherlands BV
• EV Group (EVG)
• Murata Electronics Oy
• Pac Tech -Packaging Technologies GmbH
• SEMILAB FELVEZETO FIZIKAI LABORATORIUM RESZVENYTARSASAG
• Valeo Vision Systems (Connaught Electronics Limited)
• 3DiS Technologies
• RoodMicrotec
• Sencio
• Afore Oy
• Micro Analog Systems Oy
• Commissariat à l’Energie Atomique Et Aux Energies Alternatives
• Fraunhofer Gesellschaft zur Förderung der angewandten Forschung e.V.
• VTT Technical Research Centre of Finland Ltd
• Advanced Vacuum
• Packaging SiP
• NXP Semiconductors N.V.
• Ketek GmbH
• Spinverse Oy
• Nokian Tyres
• InnoSenT
• Berliner Nanotest und Design GmbH
• Angewandte Micro-Messtechnik GmbH
• Silicon Radar
• TexEDA Design GmbH
• Elmos Semiconductor AG