At the beginning of November, Fraunhofer IZM created a central platform for exchange and networking around microelectronic packaging and heterogeneous system integration with the Electronic Packaging Days 2025. Over two days, around 200 experts from industry, research, and public institutions gathered in Berlin to discuss current developments, technological challenges, and strategic perspectives.

In addition to technical presentations, laboratory tours and expert sessions facilitated direct exchange between researchers and industry partners.

The event impressively demonstrated how closely technological innovation, industrial application, and European cooperation are linked in the field of packaging and system integration.