Fraunhofer Institute for Reliability and Microintegration IZMThe ELIV congress takes place every two years in Bonn and has developed into one of the most important events of its kind over the last few years – even on an international level.
The exchange between automotive manufacturers and suppliers within the realm of the congress has increasingly become a ‘must’ to capitalize upon innovation, new developments and challenges in automotive electronics ahead of time. These topics have been discussed for many years at the congress, while trends were set and important bases for decisions were made in the automotive industry at the same time.
This two-day congress will feature experts from OEMs and suppliers as well as members of universities and research institutes, who will present practical presentations examining current developments and news about trending topics. There will also be ample opportunities for discussion and questions in the open forums. In addition to the presentations, participants will be able to learn about new products and services from well over 100 suppliers and service providers at the accompanying trade exhibition.
The trade exhibition as an accompanying highlight
Learn about the newest developments and innovations on site. In 2017 alone, 145 national and international exhibitors presented at ELIV and that group of professionals will offer you a great deal of added value, thanks to centralization at one location. Make sure to stop by the Fraunhofer IZM booth, where we will be presenting the latest developments in packaging and power electronics for automotive applications.
Events
Development of a LIDAR sensor 3D-SiP using high density TSV, bumping and flip chip technologies
For the build-up of these sensor modules, Fraunhofer IZM per-ormed all packaging-related tasks such TSV and RDL formation, micro-solder bumping, flip chip assembly, as well as chip and wire bonding. Each module consists of a single photon avalanche diode (SPAD) array with 256 x 256 = 65,536 pixels (pitch 40 μm) which is implemented on a 10 x 10 mm² silicon die (total thickness: 88 μm). Each SPAD cell includes a TSV (di-ameter: 8 μm, depth: 88 μm) which routes the electrical contact to the back of the SPAD array where micro-solder bumps (diameter: 25 μm) connect each pixel to the read-out ASIC (12 x 12 mm², thickness: 725 μm). The 3D-SiP module was finally die bonded to a PCB and the peripheral IOs along the four sides of the ASIC were connected to it by wire bonding.
Package developed at Fraunhofer IZM for a LIDAR-sensor as 3D system-in-package