© Fraunhofer IZM | Volker Mai
Conformable Electronics represents an attractive entry point into the world of dynamically malleable, structural, three-dimensional electronics.
Every two years experts from all over the world meet at Productronica in Munich to get the lowdown on new trends and innovations in the electronics sector.
This year, Fraunhofer IZM will be exhibiting at the joint booth of the Fraunhofer Gesellschaft. Here we present the latest trends in electronic packaging, smart system integration and reliability analyses from our laboratories. Have a look at the newest applications in power electronics, assembly and interconnection technologies.
We look forward to welcoming you in Hall B2, Booth 315.
Additional booths with Fraunhofer IZM participation:
Future Packaging Stand - Halle B2, Stand 480
Fraunhofer IZM / ASSID - Halle B1, Stand 221
For the build-up of these sensor modules, Fraunhofer IZM per-ormed all packaging-related tasks such TSV and RDL formation, micro-solder bumping, flip chip assembly, as well as chip and wire bonding. Each module consists of a single photon avalanche diode (SPAD) array with 256 x 256 = 65,536 pixels (pitch 40 μm) which is implemented on a 10 x 10 mm² silicon die (total thickness: 88 μm). Each SPAD cell includes a TSV (di-ameter: 8 μm, depth: 88 μm) which routes the electrical contact to the back of the SPAD array where micro-solder bumps (diameter: 25 μm) connect each pixel to the read-out ASIC (12 x 12 mm², thickness: 725 μm). The 3D-SiP module was finally die bonded to a PCB and the peripheral IOs along the four sides of the ASIC were connected to it by wire bonding.