FUTURE PACKAGING 2025 - Your live Productions line at the productronica 2025!
Experience the first live lab in the 50-year history of productronica: reliable, efficient, and sustainable processes presented on site!
Throughout the productronica trade fair, the »Future Packaging« line will be showcased in two daily tours that will comprehensively highlight aspects of the value chain of AVT processes and technologies. Take advantage of this unique opportunity and learn about every step in detail, from an empty circuit board to the finished and separated component. In addition, actual consumption will be recorded in the real-world laboratory to detect the various factors that influence the CO2 footprint of assembly production.
Future Packaging »The Line«
By Fraunhofer IZM
Participants
- ATEcare Service GmbH & Co. KG
- ATN Automatisierungstechnik Niemeier GmbH
- Brady GmbH
- EKRA Automatisierungssysteme GmbH (ASYS Group)
- F&K Delvotec Bondtechnik GmbH
- Fuji Europe Corporation GmbH
- IBL-Löttechnik GmbH
- Indium Advanced Materials GmbH (Solder Chemistry)
- IPTE Factory Automation NV
- Nordson Electronic Solutions (Asymtek)
- Optimum datamanagement solutions GmbH
- Smartlink-SMT GmbH
- Teknek