Digital Exhibition  /  July 28, 2020  -  July 29, 2020

Future Packaging Production Line at SMTconnect

»The Line« – Staying on Your Feet and Ahead of the Curve

The sheer pace of development in electronics continues to inspire awe and has taken many observers by surprise. Human nature is to blame: We often lack the cold calculating mind and detached spirit needed to really anticipate market trends and not be left trailing in their wake.

The line at SMTconnect 2020 manages this balancing act in a cooperation of Fraunhofer IZM with its many engineering, technology, and process partners. Since the Fraunhofer IZM, as part of the Research Fab Microelectronics Germany, is already developing the technologies for the next 5 to 10 years today and sharing its insights with its project partners, there is an opportunity for everyone involved to stay ahead of the curve. This concerns a vast range of trends and currents. Be it the optimization of actual production processes or the ubiquitous topic of data connection: Each and every individual technology and process can be discussed in detail and new avenues found for their practical implementation.

The line at the »Future Packaging« joint booth intends to offer the visitors of SMTconnect 2020 an opportunity to get a full and meaningful overview, with the right people available to discuss constructive solutions to your challenges.