SPIE Photonics West Exhibition 2021

The Moscone Center, San Francisco, USA / March 09, 2021 - March 11, 2021

Fraunhofer IZM presents current trends in photonic packaging at Photonics West 2021!

http://spie.org/conferences-and-exhibitions/photonics-west/photonics-west-exhibition

The Photonics West is the most influential conference for biophotonics and biomedical optics, high-power laser manufacturing, optoelectronics, microfabrication, and green photonics. This year it will be taking place from 9 March – 11 March 2021 at the Moscone Center in San Francisco, USA. Photonics West brings together more than 1,250 exhibiting companies and 20,000 attendees from both the United States and the international community.

We look forward to welcoming you at our booth at Photonics West 2021!

The focus of the presentation will be on:

Thin glass-based Electrical-optical-circuit-board (EOCB) and optical subassemblies for high bandwidth applications
3D integration, sub-micron automated assembly, and reliable packaging
Photonic integration platforms (optical substrates, components and interconnects)
High bandwidth optical fiber based modules
Photonic design for packaging
Low cost approaches for high volume applications

EOCB-Demonstrator

The here shown electro-optical circuit board consisting of an optical layer laminated into an electrical circuit board. The optical layer contains glass-integrated waveguides made by ion-exchange technique. This technique enables the production of low loss (<0.1 dB/cm) both single- and multi-mode waveguides. Fraunhofer IZM has scaled up the process on large panel sizes up to 440 x 305 mm² in low-cost display glasses. The open areas in the board can be equipped with pluggable coupling elements for the coupling into line cards (HDPuG). EOCB are therefore a prime candidate for data communication inside high performance computers, core routers and next generation consumer devices.

SiGe 400 Gbps Optical Chip Modulator Package

Fraunhofer IZM within research project SPeeD embedded various photonic integrated circuits (PIC) fabricated in SiGe-BiCMOS technology by partner IHP. Next generation optical fiber transmitters and recceivers will require 400Gbit/s and faster data rates transmission. This version uses a spot size converter chip to couple optical fibers to chip integrated waveguides in a newly standardized package. Funding by German BMBF.”

Molded Optical Transceiver Package for Solder Mount

Cost-efficient molded optical transceiver package in surface mount technology, developed in cooperation of Fraunhofer IZM and HHI, embedding an InP laser chip, a PolyPhotonics based modulator for 10 Gbps C-band operation. Optical transmission single mode silica fibers can simply get clicked into position, the package is producible in industrial large panel electronics fabrication machines, not shown here is an overmolding that can hermetically close the package.

SPAD Chip Die Array Mounted on CMOS Chip for LiDAR

Pixelated single photon avalanche detector chips for automotive LiDAR-application, mounted on structured silicon chip including through-silicon-vias and routing layers, demonstrating the versatility and precision of wafer level in packaging chip based assemblies. Fraunhofer IZM sites in Berlin and Dresden develop highest accuracy chip and RF component placing and embedding processes and geometries, scalable on wafers up to 300 mm diameter.

Interposer-based 4-channel Midboard Optical Transceiver

Within the project HyPOT, Fraunhofer IZM has developed a hybrid integrated glass-silicon based interposer for data communication at a wavelength of 850 nm.

A glass interposer with through glass vias (TGVs) is used as a carrier for flip-chip mounted VCSEL, PD and driver ICs. The interposer processing at wafer level using state-of-the-art technology allows a high density redistribution layer and high aspect ratios for TGVs. The RF routing on the glass interposer is optimized for data rates up to 28Gbit/s/channel. The optical path crosses the transparent substrate material with individual Fresnel or polymer lenses applied.

Advantageously for cooling is the bottom emitted optical signal and the flip-chip approach which allow an improved cooling of the components from the top. This approach excels cooling possibilities of commercial products. The optical design reduces losses down to <0.5 dB for RX or <2 dB for TX.

Fraunhofer IZM - 4-Kanal Mid-Board-Optical Transceiver. Die elektro-optischen Komponenten sind mittels Flip- Chiptechnik auf einem Glasinterposer aufgebaut. — © Fraunhofer IZM | Volker Mai

Hybrid Multi-Laser Emitter Fibre Coupling

The multi-emitter module project has achieved the efficient coupling of a four-emitter laser chip at a wavelength of 1470 nm to an optical fiber with a 70 µm core, suitable for medical uses. Fraunhofer IZM performed the high-precision mounting of the micro-optical bank consisting of laser-produced glass components on a footprint of 6.5 mm by 25 mm. Four microoptical elements (FAC, beam twister, SAC, and fiber coupling lenses) were mounted with active alignment at full optical laser output of 10 W. To achieve this, special alignment and joining processes were developed for an industrial pick & placer for optical components to achieve precision alignment with six degrees of freedom in accuracies of better than 200 nm and two arcsec, respectively.

Project partner: Eagleyard Photonics and FISBA Photonics

© Fraunhofer IZM/ Volker Mai
Hybrid Multi-Laser Emitter Fibre Coupling

Free Beam Laser Module for Sensor Applications

The AutoFly project has produced an automatically packaged 808 nm laser module. The package can be hermetically sealed for application in harsh conditions. The high-precision mounting of a double-sided single lens with an innovative optical pick&placer was fully automated, with active alignment used to achieve a highly collimated and aligned free beam. This makes the system particularly suitable for sensor and interferometer applications.

Project partners: Eageyard Photonics and FiconTEC

© Fraunhofer IZM/ Volker Mai
Free Beam Laser Module for Sensor Applications

Radial Fire – Laser structured fibre optic tip for minimally invasive laser therapy

Modern medicine treats venous disorders with laser therapy. A fibre optic system is carefully inserted into the affected veins and uses a laser to ablate the damaged tissue. The Fraunhofer IZM has developed a novel process that uses a laser to produce the cone-shaped fibre optic tips for the system with unrivalled precision. With typical diameters of only 0.6 mm, the system can now be used to treat even tiny capillary veins.

Project Partner: CeramOptec

Radial Fire – Laser structured fibre optic tip for minimally invasive laser therapy — © Fraunhofer IZM/ Volker Mai
Laserstrukturierte Glasfaserspitze vom Typ Radial Fire für die minimal-invasive Lasermedizin

Packaged broad-band VIS-NIR nanospectrometer

Chip package with optical interconnections, spectral operation from 400nm to 1000nm from EU-project InSPECT with partners Lionix (chip manufacturing), Aifotec (fiber array assembly), and others.

SiGe-modulator chip in evaluation board

Telecom receiver realized in SiGe-BiCMOS, coupling via grating couplers for 400Gbps coherent data transmission from BMBF-project SPeeD with partners ADVA, IHP, and others.