ECTC – 2027 IEEE 77th Electronic Components and Technology Conference

The Electronic Components and Technology Conference (ECTC) brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society. This year’s conference will be taking place from June 1 to June 4, 2027 in Denver, Colorado. Fraunhofer IZM will present current trends in the field of electronic packaging at the accompanying trade exhibition.