Event Review

Seminar “Polymers in Microelectronics”: From Adhesion to Aging

Microelectronic applications rely on a wide range of materials to function. Polymers, be they filled or unfilled, in particular suffer from certain intrinsic traits that affect their durability. On October 13th, 2016, the Fraunhofer IZM in Weßling-Oberpfaffenhofen invited 20 professionals working in the field of mounting and connector technology in power electronics for a work-shop on polymer aging. The many presentations given by speakers from the Fraunhofer IZM in Berlin and Oberpfaffenhofen covered the basics of polymer bonding, the issue of reliability in humidity, and the effect of time and temperature exposure. The talks also discussed the potential and limitations of simulations in this field of production technology. In addition to sharing expertise on the right selection of polymers for microelectronic applications, the event left more than enough room for debates and a tour of the facilities at Weßling-Oberpfaffenhofen.