Trends in system integration Key topic for 2009: Reliability tests using combined loading

Berlin, /

Trends in system integration
Trends in system integration

Fraunhofer IZM is holding a two-day event in Berlin on trends in system integration.

Customized solutions and the integration of non-digital functional elements, such as sensors and power electronics, are the future of microelectronics/MST in Europe. This means that electronic packaging will become a key focus in the industry. What range of technologies is available? What developments can be expected? And lastly, which is the right technology for my company/project? The first day of the event will deal with these pressing questions. In the morning, IZM scientists will present the current state of technology in system integration on substrate and wafer level. After lunch, parallel workshops will examine the topics in more detail. Additional workshops on system design and reliability analysis will also be held.

What precisely are the current reliability demands on electronic systems? How are such systems tested and qualified? The second day of the event is dedicated to these questions, which fall under the rubric of this years key topic: Reliability tests using combined loading.

The afternoon will feature a particular program highlight, namely the opening of Fraunhofer IZMs new Electronics Condition Monitoring Laboratory. Thanks to the new laboratory, we are finally able to simulate combined loading, including temperature (cycling), moisture and vibration, and feed these results into our research on reliability analysis.

Now available:

CD-ROM Trends in der Systemintegration - Fokus 2009 for 49.90 Euro. The CD-ROM contains the slides from all presentations (in German).

Please see the program for more information about the topics. For further information and to order the CD-ROM please contact Stefan Ast.

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