IMAPS Best Paper of Session Award for Ivan Ndip

Raleigh, / November 28, 2010

Dr. Ivan Ndip

Fraunhofer IZM’s Ivan Ndip seems to have a subscription for awards at the US-American IMAPS Conference – following 2003, 2007 and 2009 he and his co-authors received the Best Paper of Session Award for the 4th time at this year’s conference. The 43rd IMAPS International Symposium on Microelectronics took place from Oct. 31 – Nov. 4, 2010 in Raleigh, North Carolina (USA).

This year Ndip and his IZM-colleagues Christian Tschoban, Stefan Schmitz, Andreas Ostmann, Martin Schneider-Ramelow, Stephan Guttowski, Herbert Reichl and Klaus-Dieter Lang were honoured for their paper „Modeling and Optimization of Bond Wires as Transmission Lines and Integrated Antennas at RF/Microwave Frequencies“. In the project described here wire bonds are modelled as 3D antennas and systematically optimized for RF-applications of up 60 GHz.

The International Microelectronics and Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging. Its annually organized international symposium on microelectronics is the largest symposium related to the microelectronics industry and the electronic packaging industry in the world.