In 2015, Fraunhofer IZM-ASSID took an important milestone for qualified customer-specific process development. In April, the International Certification Group (ICG) certified the "All Silicon System Integration Dresden - ASSID" center of Fraunhofer IZM as having a management system in accordance with the DIN EN ISO 9001:2008 standard and certified it for the scope "Research, development and services in the field of electronic packaging".

At Fraunhofer IZM-ASSID, state-of-the-art wafer-level packaging and system integration technologies for 3D integration using silicon through-plated vias (TSVs) are developed and implemented in a prototyping process. Fraunhofer IZM-ASSID works closely with equipment and material manufacturers in this field.

The center has an industry-compatible 300mm pilot line for TSV formation and 3D wafer-level system-in-packages.