Ivan Ndip, Stephan Guttowski and Herbert Reichl received the IMAPS 2007 Best of Session Award for their outstanding paper entitled, “Development of an M3-Approach for Optimal Electromagnetic Reliability in System Packages”, presented at the 40th International Symposium on Microelectronics (IMAPS 2007) in San Jose, CA, USA.
In this paper, the aims, advantages and applications of a novel approach, the M3-approach (Methodologies->Models->Measures), developed at Fraunhofer IZM for optimal, reliable and cost-effective design of interconnects, packages/boards and integrated components are discussed. Using a system-in-package module as an example, it is illustrated how the M3-approach can be used to ensure optimal electromagnetic reliability.
The International Microelectronics and Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging. Its annually organised international symposium on microelectronics is the largest symposium related to the microelectronics industry and the electronic packaging industry in the world. IMAPS 2007 took place from Nov. 11th to 15th, 2007.