Martin Schneider-Ramelow accepts appointment as director of Fraunhofer IZM
With the approval of the Senate Chairmen and the Scientific and Technical Council of the Fraunhofer-Gesellschaft, Prof. Martin Schneider-Ramelow has received and accepted the appointment committee’s call to be the director of Fraunhofer IZM. Concluding the appointment process, Martin Schneider-Ramelow has now been entrusted with the leadership of Fraunhofer IZM as one of the world's leading research institutes in the field of microelectronics.
For Fraunhofer IZM's research partners and employees, this marks the continuation of a fruitful collaboration, as Prof. Schneider-Ramelow knows the institute like the back of his hand and has played a leading role in its extremely successful scientific and economic development over the last decades. We congratulate him on his appointment and look forward to a promising collaboration.
In 1998, the materials scientist came to Fraunhofer IZM in Berlin and took over as group leader of the Chip and Wire Technologies division in 2004. His special passion for wire bonding technology stems from this time, a topic he still pursues with great interest today. From 2008 - 2018, Martin Schneider-Ramelow headed the System Integration and Interconnection Technologies (SIIT) department. He has authored or co-authored more than 250 publications in the field of packaging and system integration and has made a name for himself worldwide as a specialist in the quality and reliability of metallic interconnects.
Martin Schneider-Ramelow has been teaching at TU Berlin since as early as 1992, continuing in 2014 as an honorary professor (in the field of "Electronic Materials /Electronic Packaging Technologies") and since January 2017 as a professor for "Materials of Hetero System Integration" at Faculty IV Electrical Engineering and Computer Science.
In August 2020, Martin Schneider-Ramelow took over as acting director of Fraunhofer IZM and, the following year, as director of the TU Research Center for Microperipheric Technologies, which has cooperated closely with Fraunhofer IZM since its foundation in 1993. A special focus of his work is the promotion of young scientists in the field of electronic packaging. Schneider-Ramelow, who has been chairman of the German chapter of the International Microelectronics and Packaging Society (IMAPS) since 2009 and was also president of IMAPS Europe from 2015-2017, significantly drives the networking of the European packaging community through his activities. He is a Senior Member IEEE and Fellow of IMAPS USA, an honor bestowed on very few members.
For more information on Prof. Martin Schneider-Ramelow's numerous activities, click here.