Next generation of FO-PLP and IC-Substrates
EVATEC AG and Fraunhofer IZM are cooperating in the field of advanced organic IC substrates and fan-out Panel Level Packaging. Focus is on advanced thin film etching technology for panel sizes up to 650x650 mm. New equipment as part of the Research Fab Microelectronics Germany (FMD) has been recently installed in Berlin.
EVATEC AG, a leading supplier of thin film equipment and process solutions in Advanced Packaging, Semiconductor, Optoelectronics and Photonics applications, has successfully completed the installation of a Clusterline 600 Panel Level Packaging Etch system at Fraunhofer IZM, Berlin.
The CLN600 platform is a dedicated Etch and Sputter equipment for FO-PLP and next generation IC-Substrates that supports panel sizes up to 650x650 mm and is the leading solution in this markets. The installed Etch System delivers superior etch uniformity across large scale substrates and is capable to perform physical Ar Etch as well as RIE (Reactive Ion Etching) and DRIE (Deep Reactive Ion Etching) applications.
With this installation, EVATEC AG has enhanced its leadership position in the growing panel level packaging segment. The tool is prepared to support process and technology development programs such as the Panel Level Packaging Consortium 2.0. In order to address these challenges, further equipment installations were made at Fraunhofer IZM in the run-up to PLC 2.0. We would also like to thank the Federal Ministry of Education and Research of Germany (BMBF) for funding the project Research Fab Microelectronics Germany (funding code 16FMD01K, 16FMD02 and 16FMD03).
Fraunhofer IZM is proud to have this state of the art CLN600 System platform in their equipment park and to mount on EVATEC AG as a strategic partner. "We are excited about the new opportunities and capabilities this system offers to the institute in the very dynamic Panel Level Packaging environment.“ says Lars Böttcher, a scientist at Fraunhofer IZM and expert in PLP.