Prof. Ivan Ndip receives the Sidney J. Stein International Award 2025

Prof. Ivan Ndip und der Vorsitzende der International Microelectronics and Packaging Society (IMAPS) Prof. Martin Schneider-Ramelow / Prof. Ivan Ndip and the presiding chairman of the International Microelectronics and Packaging Society (IMAPS) Prof. Martin Schneider-Ramelow
Prof. Ivan Ndip and the chairman of the International Microelectronics and Packaging Society’s German Chapter, Prof. Martin Schneider-Ramelow.

On the occasion of the 58th International Symposium on Microelectronics (IMAPS Symposium 2025) in San Diego, CA, USA, Fraunhofer IZM department head Professor Ivan Ndip was honored with the Sidney J. Stein International Award 2025 for his significant international technical contributions to the microelectronics packaging industry and his extraordinary commitment to IMAPS at the international level.

IMAPS (International Microelectronics and Packaging Society) is the world's largest association for promoting technological progress in the fields of microelectronics and microelectronic packaging. Each year, individual members of IMAPS are honored with the “Society Awards” for outstanding achievements. Professor Ndip is an internationally renowned expert in miniaturized and application-specific high-frequency sensors and high-speed systems, as well as in research into novel millimeter wave and terahertz packaging solutions for these systems.

Prof. Ivan Ndip

Prof. Dr.-Ing. Ivan Ndip Abteilungsleiter RF & Smart Sensor Systems am Fraunhofer IZM Berlin
© MIKA-fotografie | Berlin

Ivan Ndip is a full Professor at the Brandenburg University of Technology (BTU), Cottbus-Senftenberg in Germany. He is also with Fraunhofer IZM, where he has been working since 2000. At IZM, he currently leads the Department of RF & Smart Sensor Systems in Berlin and the IZM Branch Lab for High-Frequency Sensors and High-Speed Systems in Cottbus. While working at IZM, he also served as a Lecturer at the Technische Universitaet (TU) Berlin from 2008 to 2019.

He is the author and co-author of more than 250 publications in referred journals and conference proceedings, and has more than 35 German, European and US patents. His research has been honored with numerous national and international awards, including the IMAPS Outstanding Educator Award 2024.

Professor Ndip is a Fellow and Life Member of IMAPS as well as a Senior Member of IEEE. He served on the Executive Board of IMAPS as Director from 2016 to 2020.

He studied electrical engineering and obtained his Dipl.-Ing. (M.Sc.), and Dr.-Ing. (PhD) with the highest distinction (summa cum laude), in 2002 and 2006 respectively from TU Berlin. In 2017, he received his second doctorate degree, Dr.-Ing. habil., also in electrical engineering from BTU Cottbus-Senftenberg.

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