Symposium  /  06/30/2020

Panel Level Packaging Symposium

It is our great pleasure to invite you to the next Symposium on »Status & Trends in Panel Level Packaging« at Fraunhofer IZM in Berlin.

Join the symposium to receive latest research results on this exciting new manufacturing technology enabling:

  • Market and application trends
  • Latest technology results for PLP
  • Material, equipment and process developments for large area and fine line processing
  • Cost analysis
  • Status and Get together with PLC 2.0 Consortium