Equipment

The mold encapsulation lab offers various encapsulation processes, related material and package analysis and reliability characterization tools as a one-stop-shop.

• Compression molding on module- and wafer level
• Compatibility to PCB-based and thin film RDL application
• 3D-redistribution by through mold vias (TMV)
• Transfer molding of leadframe-based SiPs and of SiPs organic substrates (MAP molding)
• Rapid tooling for feasibility studies with real live prototypes
• Sensor packages with exposed sensor areas by film molding
• Transfer molding of large volume packages

Transfer to industrial production is guaranteed due to use of production equipment.