Mold encapsulation lab
The mold encapsulation lab offers various encapsulation processes, related material and package analysis and reliability characterization tools as a one-stop-shop.
- Compression molding on module- and wafer level
- Compatibility to PCB-based and thin film RDL application
- 3D-redistribution by through mold vias (TMV)
- Transfer molding of leadframe-based SiPs and of SiPs organic substrates (MAP molding)
- Rapid tooling for feasibility studies with real live prototypes
- Sensor packages with exposed sensor areas by film molding
- Transfer molding of large volume packages
Transfer to industrial production is guaranteed due to use of production equipment.