Panel Level Packaging - Fraunhofer IZM
© Fraunhofer IZM/ Volker Mai
Panel Level Packaging - Fraunhofer IZM
© Fraunhofer IZM/ Volker Mai
Panel Level Packaging - Fraunhofer IZM
© Fraunhofer IZM/ Volker Mai
Panel Level Packaging - Fraunhofer IZM
© Fraunhofer IZM/ Volker Mai
Panel Level Packaging - Fraunhofer IZM
© Fraunhofer IZM/ Volker Mai

Equipment

Mold Encapsulation Lab

Labor zur Moldverkapselung

The mold encapsulation lab offers various encapsulation processes, related material and package analysis and reliability characterization tools as a one-stop-shop.

  • Compression molding on module- and wafer level
  • Compatibility to PCB-based and thin film RDL application
  • 3D-redistribution by through mold vias (TMV)
  • Transfer molding of leadframe-based SiPs and of SiPs organic substrates (MAP molding)
  • Rapid tooling for feasibility studies with real live prototypes
  • Sensor packages with exposed sensor areas by film molding
  • Transfer molding of large volume packages

Transfer to industrial production is guaranteed due to use of production equipment.

More information

 

From Fan-out Wafer to Panel Level Packaging