Training

 

Courses for chip and wire bonding

Chip and Wire bonding represents the largest part of all interconnection technologies used in semiconductor assembly and is constantly being used, optimized and further developed at Fraunhofer IZM.
 

Working group »EcoReliability«

Within the EcoReliability working group – Reliable and Sustainable Electronics – challenges and potential solutions arising from industry-related applications and research are discussed and scientifically examined in collaboration with industry partners.

 

Circular Design Workshops

We develop and facilitate creative, interdisciplinary in-house circular design sprints or open cross-sectorial circular design trainings. We have a proven track record of developing new methods or adapting existing design tools to your specific needs (e.g. product, service, business design) – integrating user-centric design, life-cycle thinking and design-thinking.