Working group System reliability of packaging technologies
Up to this point the main focus of quality and reliability considerations was put on specific issues of packaging technology. As of now the interdependency and impact on the overall system of various components and its packaging becomes the focus of research and development due to its increasing importance.
In addition to specific technical and technological issues, such as process influences, whisker forming or electro-migration, the focus is put on long-term reliability and the field behavior of complete systems. Comprehension of combined failure mechanisms must be developed continuously.
The Workgroup is a forum to discuss and scrutinize challenges and solution approaches of industrial applications and research with partners from the industry.
The workgroup is supported by the ZVEI and FED. Fraunhofer IZM holds management and organization.
With the introduction of lead-free connection technique on 1st July 2006 the electronics industry enforced a part of the EU RoHS Directive. The Fraunhofer Institute for Reliability and Microintegration (IZM) founded an industry working group to lead-free joining technology in electronics in late 1999 to support the electronics industry in changing their processes. Since then about 65 companies have benefited from the presentations on the status quo and current trends of the joint test series as well as from the mutual exchange at the meetings. This exchange is continued in the working group “system reliability of packaging technologies”.
The lecture program and the entire organization is financed by the annual participation fee of 995, - € plus VAT per company and site. Members of the working group “Design conformity for WEEE/RoHS/EuP” will receive a discount of 100 €.