Green ICT: Efficient photoresist removal without toxic additives in a cleanroom
RealIZM Blog
BASF has developed an alternative stripping agent for removing photoresist from wafers, which does not contain the commonly used highly toxic additives. Initial tests run by Fraunhofer IZM-ASSID haveyielded extremely promising results. As part of the »Green ICT« research project, the agent was tested under realistic conditions that pitched it against an established reference agent.