The existing microclimate in enclosures is an elementary key point in the investigation of defects that are attributed to moisture. Currently, there are hardly any reliable statements on the microclimatic conditions in enclosures.
The aim of the project “RoDosH“ is to investigate the local microclimate in packages respectively housing of power electronic applications and to derive effective local loading conditions. The focus will be on temperature and humidity. Additionally, storage conditions should be also considered. The microclimate that is created in the housing during the application cannot be directly taken from the global mission profile. The aim of the project is to determine the relevant influence factors for humidity that diffuses into power electronics housings. Due to generally long lead times for system housings, humidity tests can only be performed in a rather late project state, which leads to the necessity of simulating the internal humidity beforehand. This should enable a simulation of the interior climate of a system under development, even before first testing is possible. The results are the basis for the optimization of test conditions in order to be able to make relevant lifetime estimates for power electronics in sealed housings.
Project duration: 01.06.2020-31.12.2021
Funded by: This project was supported in the frame of the ECPE Joint Research Programme.