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Testing, Qualification, Reliability

Corrosion, Electrochemical Migration and Humidity Diffusion

Modern electronic systems are increasingly exposed to constantly changing environments in terms of humidity and variations of temperature cycling and thermal shocks. At the same time, the ongoing trend of miniaturization results in smaller designs, components and by that more tightly packaged systems. Extra space that could buffer external stresses like humidity becomes smaller; diffusion paths by that become shorter. This leads to higher / quicker / faster electrochemical degradation, an effect long ignored by the industry. Generally, this type of degradation leads to failure of the electric circuit. It is essential to test these materials used for encapsulation in terms of their reliability and possible characteristic changes during life-time. Additionally, the need to consider the forces exerted and possible residues left behind during production should be considered from the start.

We can assist you with:

  • Identification of the driving forces and parameters affecting failure mechanisms relating to corrosion or migration effects
  • Optimization of designs for harsh environments
  • Assistance during the selection and qualification of suitable materials
  • Simulations for a cost-efficient evaluation of design changes and their potential improvement over existing layouts

More services relating to Testing, Qualification, Reliability

 

Thermal Management

Careful thermal management is important to ensure reliable operations even with high power losses, and high heat fluxes and ambient temperatures.

 

Thermal Characterisation

Infrared thermography can be used for non-destructive and contact-free measurements of heat radiation from the surface. High-resolution measurements can register very small objects (10µm per pixel) and rapid transient processes (up to approx. 3kHz).

 

Analytical, Numerical and Experiment-Based Assessment of Electromigration in Electrical Contacts

One factor limiting the reliability of increasingly miniaturized electronic systems is failure due to electromigration. This current- and temperature-induced mechanism displaces atoms in the conducting material, leading to defects in the electrical traces and solder joints.