Structure analyses

image teaser riss im bump
© Fraunhofer IZM
Crack detection on loaded solder ball
image teaser Kupfer Hülse
© Fraunhofer IZM
Grain orientation in Copper at single through holes

Various approaches deal with microstructure-properties correlation of electronic relevant materials for high reliable microelectronic components. Thereby, the structural analysis is important for the basic understanding of material relevant relationships and is important for the further development of electronic components of next generation.  

Analysis methods consider:  Analysis of microstructure,  analysis of particles and detection of local effects/defects

Various microscopic methods can be used for microstructural analysis:

  • Optical Stereo Microscope as a highly flexible imaging technique to analyse surfaces with visible light.
  • Scanning Electron Microscopy (SEM) for inspection of object surfaces with high magnification.
  • Electron Backscatter Diffraction measurement technique (EBSD) to analyse crystalline structure and crystallographic orientation.
  • Energy Dispersive X-ray Spectroscopy (EDX analysis) for detection of chemical elements.
  • X-Ray microscopy as an inspection method for non-destructive detection of objects.
  • Electron spectroscopy for chemical analysis (ESCA) to identify the elements qualitatively and quantitatively on surfaces.

Atomic Force Spectroscopy (AFM)  to analyse spatially resolved quantities:

  • Local surface topography (roughness, …)
  • Adhesion and modulus on small surfaces

Spectroscopic  methods:

  • RAMAN Spectroscopy to analyse chemical structure, crystallinity and molecular interaction