Wafer Level System Integration

Key Research Areas // Sensor Development and Integration

Sensor Development and Integration

Micro-mechanical sensors are gaining increasing importance in application areas e.g. automotive, entertainment, industry especially due to their small form factor, light weight and lower production costs. Fraunhofer IZM offers a complete development – from requirements, concept, manufacturing of sensor elements to packaging and test – of sensors for the measurement of physical parameters e.g. pressure, acceleration, force, gas concentration. For the realization of micro-mechanical sensors, different physical semiconductor effects can be used of to achieve a sufficiently high sensitivity and satisfying linearity.

 

Low-pressure high temperature SOI sensor

SOI based pressure sensor for measurement up to 400°C

Schematic of pressure sensor

Focus of Research

Pressure Sensors

  • Miniaturized pressure sensors (measuring range 1-400 bar, operating temperature up to 125°C)
  • High pressure sensors (measuring range up to 1000 bar, operating temperature up to 125°C)
  • High temperature sensors (measuring range 1-750 bar, operating temperature up to 350°C)
  • Low pressure sensors (measuring range < 100 mbar, sensitivity area µV/VkPa, operating temperature up to 125°C)

Acceleration Sensors

  • High-G acceleration sensors up to 60.000 g
  • Precision accelerations detection for motion recognition with high sensitivity and good linearity performance

Gas Sensors

  • Detection of VOC gases with SiC-based heating platforms
  • Detection of CH4, H2, NO2, CO and C02 with metal oxide sensor layers

R& D Services

With in this research field, the department WLSI offers a broad spectrum of services. For specific questions do not hesitate to contact us.

  • Sensor design
  • Reliability and lifetime optimization
  • Standard and customer-specific packaging with integrated sensor data processing e.g. TO8,  packages with  media separation, molding
  • Characterization of pressure (10 m-100 Bar), gas and acceleration sensors (up to 40 g)

 

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Flyer "Silicon Microsensors"

All information condensed in one flyer.

Cooperation

Research Group „Silicon Microsensors“

The Berlin University of Applied Sciences (HTW) and Fraunhofer IZM work together to advance research into microsensors.