Key Research Areas

Packaging of communication modules comprises a multitude of technologies. Due to rising operation frequencies the impact of interconnects to signal amplitude and integrity becomes more relevant. We develop, analyze and optimize all connections in a package with respect to the technology for the development of new productions processes as well as for the production of state-of-the-art modules. We have a deep understanding of various process steps and their effects on signal integrity to optimize circuit layouts accordingly.

The spectrum of applications is huge and grows. It covers well known applications in wireless communication, e.g. base stations for 4G, 5G and upcoming 6G mobile networks up to specialized satellite communications system, such as LEO, MEO and GEO (terrestrial and space elements). Beyond that a multitude of radar sensor applications become more important, such as autonomous driving, e.g. tracking of trains, buses and other vehicles to optimize traffic and to avoid accidents) and home or consumer applications, (e.g. detection of persons and for home device control).