Assembly and Encapsulation

We research integration technologies for system-in-package products, focusing in particular on device assembly for highly integrated packages and joining/encapsulation processes based on polymeric materials. Our technology portfolio includes pick-and-place processes – also for large-area substrates and 3D assemblies – and a wide variety of encapsulation processes, from dispensing and jetting to transfer and compression molding. Material, process and device analyses complete our range of expertise.

Panel-level packaging

Developing demands and the market show two main trends helping to shape the ongoing development of system integration technologies. First of all is an ongoing increase in the number of functions directly included in a system — such as electrical, optical, mechanical, biological and chemical processes — combined with the demand for higher reliability and longer system lifetime. Second is the increasingly seamless merging of products and electronics, which necessitates adapting electronics to predefined materials, forms and application environments.

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Fan-out wafer- panel level packaging

Cost-effective and individualized advanced electronic packaging in small batches now available
© Fraunhofer IZM | Volker Mai

Fan-out Wafer Level Packaging (FOWLP) is one of the latest packaging trends in microelectronics. FOWLP has a high potential for significant package miniaturization concerning package volume but also its thickness. Technological core of FOWLP is the formation of a reconfigured molded wafer combined with a thin film redistribution layer to yield an SMD-compatible package.

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Power module for Formula 1 with substrate water cooling

Power module for Formula 1 with substrate water cooling
© Fraunhofer IZM

Main goals for a Formula 1 power module are highest power density and lowest weight. Volume and weight of presented converter could be reduced by roughly 50 percent compared to previous versions.

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Balling for SiP / balling for interposer

Today’s packages with their high I/O counts call for high density interconnect schemes, typically a ball grid array configuration for SMT compatible mounting is used. Balling processes are also applied for Chiplet interposers, fan-in and fan-out wafer-level packages and for single die bumping. For the balling process solder preforms of different diameters (> 80 µm) and different alloys (SnAgCu, SnBi, Cu-core, …) are used.

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Assembly

Mounting of SMDs down to 008004, for flip-chips / chiplets to 40x40 mm² and sensor components / MEMS on a range of substrates up to 520x620 mm², with a degree of precsion of up to +/- 3 µm.

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Material dosing

Precise application of a range of contact materials (incl. Solders, conductive adhesives, sintering pastes) and structural adhesives on substrates (PCBs, flex, interposers, chips) by dispensing, jetting, pin transfer, or printing.

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Process-oriented material analytics and process simulation

Development of technologies at Fraunhofer IZM is closely connected with process-oriented analytics of used materials. The investigations are focused on measurement of material characteristics under process conditions as well as systematic studies of aging processes of polymers under harsh environmental conditions.

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Encapsulation

Protection of components by compression and transfer molding, underfilling, GlobTop, potting; production of reconfigurable wafers / panels with embedded chips by compression molding for Fan-Out Wafer and Panel-Level Packaging; production of 3D functional structures (incl. antennas) and 3D substrates by compression molding or direct metallization.

Reactive polymers are used primarily for encapsulation purposes. Typical choices include highly filled epoxy systems [EP] for molding, flip-chip underfilling, or GlobTop. Other polymer classes are available for specialized applications, e.g. highly thermally stable silicones [SI] for encapsulating power electronics or polyurethanes [PU] for potting assembled components.

Analysis

Materials, Processes, Components & Assemblies

Process analysis to support process development (by camera or high-speed camera) through in-line data capture (log files, additional sensor systems: sensor molding tool) and at-line material analysis (reaction behavior, viscosity etc.) or through the (non-destructive and destructive) analysis of finished systems.

Reliability analysis

Processes, Components & Assemblies

Assessment of process quality and stability; pre or post-load quality analysis in accordance with international standards (reflow stability, thermocycling, media resistance)

Trusted data acquisition in microelectronics manufacturing as a basis for ML-optimized processing

Project SiEvEI 4.0

In the digitization of manufacturing processes, one of the major goals is the connection of production facilities and the use of data to digitize business processes. In order to optimize manufacturing processes and maximize the quality of the resulting product, further process information and data directly from the work piece and from the manufacturing environment are required to achieve a holistic system view in addition to the selected data that the manufacturing systems already provide.

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Trusted data acquisition in microelectronics manufacturing as a basis for ML-optimized processing
© Fraunhofer IZM

AI-powered radar solution for safe autonomous driving

Project KI-Radar

Come snow, rain, heat, or gloom of night - autonomous vehicles have to be safe on the road and work in every weather. In addition, they must be able to navigate routes with little traffic and few turns just as well as busy roads in urban areas. In order to detect potential obstacles and  hazards, even those coming from the side, at an early stage, sensors are needed that enable 360° monitoring all around the vehicle. This requires extremely powerful and coordinated software and hardware components.

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Cars and trucks on motorway, with wireless communication network pictograms
© Adobe Stock | metamorworks

Recovered by Robo Ray

Project RoboSkin

Giant arsenals of unexploded ordinance are sitting on the ocean floor, lost in battle or dumped as waste. The risky job of detecting these underwater hazards is currently given to submarines specially fitted for the purpose. But even they cannot get to some of the tighter or harder to reach spots, forcing expert divers to go down and take over the often life-threatening work. A German research consortium including Fraunhofer IZM is now using a submarine robot that is as nimble and mobile as a manta ray and equipped with innovative connected sensors on its fins to gather more information about its surroundings.  

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© EvoLogics GmbH

360° real-time capture: using 3D radar sensors to drive autonomously without blind spots

Project KoRRund

In order to be able to guarantee the highest level of safety in automated driving, 3D radar modules that can be positioned relatively freely on the vehicle and integrated into a sensor network, enabling 360° all-round vision, were developed by the KoRRund project. This allows them to analyze their environment in real time and from all perspectives simultaneously.

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teaser- PM-KoRRUND
© Fraunhofer IZM

Universal sensor platform

Project USeP

Main focus of this project is a universal sensor platform. For the development of this USeP sensor package, state of the art technologies of the partners GlobalFoundries and several Fraunhofer Institutes is utilized. The package has two parts: one can be produced in advanced and includes basic core elements such as processor, memory or battery. In the second part, individually selectable sensors are included.

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teaser-pm-usep
© Volker Mai | Fraunhofer IZM

EuroPAT-MASIP

EuroPat-MASIP is committed to:

  • Modelling, designing, and simulating packaging features and challenges in the field
  • Key technologies for packaging, equipment, and materials
  • Heterogeneous (3D) integration of smart system blocks (More-than-Moore, MtM) and SIP
  • Metrology, methods and equipment, reliability, and weak spot testing procedures

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Projekt - EuroPAT-MASIP
© Fraunhofer IZM

Mold encapsulation lab

The mold encapsulation lab offers various encapsulation processes, related material and package analysis and reliability characterization tools as a one-stop-shop.

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Dr. Tanja Braun receives the "Sydney Stein Award"

2021

This year Fraunhofer IZM’s Dr. Tanja Braun received the "Sydney Stein Award" in recognition of not only her leadership in the microelectronics packaging industry, but also her significant technical contribution on an international level.

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Dr. Tanja Braun receives the „Exceptional Technical Achievement Award“ of the IEEE Electronics Packaging Society (EPS)

2021

The IEEE Electronics Packaging Society (EPS) has announced the winners of the 2021 Society Major Awards, and our group leader Dr. Tanja Braun, together with Intel’s Beth Keser, was honored with their „Exceptional Technical Achievement Award“.

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Fraunhofer IZM named "Research Institute of the Year"

2022

Fraunhofer IZM is happy and proud to receive 3DInCites award for the second time after 2018. Every year this award honors researchers and institutions for outstanding work in the field of hetero system integration of semiconductors.

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PLP - A cost effective packaging platform for heterogeneous integration

Developing demands and the market show two main trends helping to shape the ongoing development of system integration technologies. First of all is an ongoing increase in the number of functions directly included in a system — such as electrical, optical, mechanical, biological and chemical processes — combined with the demand for higher reliability and longer system lifetime. Second is the increasingly seamless merging of products and electronics, which necessitates adapting electronics to predefined materials, forms and application environments.

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Networking with Science and Industry

Panel Level Packaging Consortium

Publica

Publications

Here you can find further literature on the topic of Assembly and Encapsulation.