Our research group applies basic research in electromagnetic field and network theory to develop more efficient and accurate electrical modeling, simulation and quantification techniques. These techniques form the basis of reliable models that can be used to analyze electronic assemblies (packaging modules like SiP, SoP, CSP, BGA), multilayer PCBs, dielectric materials, electrical interconnects (such as bonding wire, flip-chip bumps), interconnections, through-vias, antennae, filters and passive RF transmitter/receivers components. Our methods and models can be applied at up to and above 100 GHz and have been validated against applicable quantification standards (of up to 110 GHz). In the final stage, the models are used to define the design task list and specifications. Here, a priority is set on developing RF and high-speed components, modules and systems that are more cost-efficient, yet sport the highest possible level of functionality and optimal electromagnetic reliability (EMR). This comprehensive and systematic design approach is known as the M3 approach (methods, models, measures).
We also provide industry and research with electrical modeling, simulation, design and quantification during the product development process, including during both pre- and post-layout phases. In the pre-layout phase, we use an M3 approach to determine the optimal packaging/system integration approach and to ensure optimal component design, placing and wiring. This is an important part of meeting the previously defined build space, cost, functionality and reliability specifications.
In the post-layout stage, state-of-the-art simulation tools and a wide range of measurement systems are used to perform a thorough electrical analysis of the product and its characterization and optimization.